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IPC Hand Soldering Competition Winner Crowned at NEPCON Japan

The 2019 IPC Hand Soldering Competition Japan concluded at NEPCON Japan in Nagoya September 20, celebrating the outstanding skills and professional achievements of talented manufacturing floor workers. Thirty-two competitors from renowned companies such as Panasonic, Mitsubishi Electronics, Advantest, NEC Space Technology and others participated in the event.

IPC Joins European Partnership for Responsible Minerals

IPC today announced it has joined the European Partnership for Responsible Minerals (EPRM) as part of its continuing efforts to help IPC members navigate the complex challenge of responsible minerals sourcing.

U.S. Electronics Manufacturers Grappling with Higher Costs from U.S. and Chinese Tariffs; U.S. Jobs and Investments at Risk

Almost 90 percent of U.S. electronics manufacturers are troubled by the higher tariffs imposed by the United States and China on each other’s imports, and some are investing less in the United States and hiring fewer workers as a result.

North American PCB Business Growth Continues

IPC announced today the September 2019 findings from its North American Printed Circuit Board (PCB) Statistical Program. Sales and orders continued to outpace last year and the preceding month in September. The book-to-bill ratio strengthened to 1.04.

Wage and Salary Survey for North American Electronics Assembly Companies Open Until November 1

IPC's biennial wage rate and salary survey for the North American electronics assembly industry is open with a response deadline of November 1. The confidential survey covers compensation for 40 hourly and salaried technical, manufacturing and sales positions at original equipment manufacturers (OEMS) and contract electronics manufacturing services (EMS) companies in North America. It also covers salary budget growth, planned increases for 2020, and employee benefits and policies.

IPC and Automotive Industry Action Group Enhance Partnership Agreement

With electronic systems expected to reach 50 percent of the total car cost by 2030, electronics companies are of critical importance in the automotive supply chain as a driver of quality and supporting OEM development goals.                  

IPC E-Textiles Europe 2019 to Bring Technical Education to European E-textiles Community

IPC E-Textiles Europe 2019, a two-day technical education conference for innovators, technologists and brands/OEMs, will provide a platform for education and collaboration among a diverse group of professionals interested in producing e-textiles technologies and products. Developed by the e-textiles industry for the e-textiles industry, IPC E-Textiles Europe 2019 will also provide technical insights of interest to myriad market segments, including fashion design, health monitoring, medical, automotive, aerospace and military. The conference will take place in Munich, Germany, November 12-13, 2019.

IPC Names Shawn DuBravac, Global Tech Trends Expert, as New Chief Economist

Today, IPC announced Shawn DuBravac, Ph.D., CFA, will serve as the association’s chief economist. In this role, DuBravac will expand IPC’s research program and provide insights on the biggest issues facing the $2 trillion global electronics industry, including supply chain resiliency/uncertainty, trade wars, skilled workforce shortage, and the expanding role of electronics in the global economy.

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2020 in San Diego

IPC invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 5, 2020, and will be displayed throughout the event, offering additional visibility.

B. Gentry Lee to Keynote 2020 WHMA 27th Annual Wire Harness Conference

B. Gentry Lee, chief engineer for the Solar System Exploration Directorate at the Jet Propulsion Laboratory (JPL) and successful science fiction writer, will present his keynote address, “A Passion for Space Exploration,” at the WHMA 27th Annual Wire Harness Conference, February 19, 2020, in Las Vegas, Nevada. During his keynote presentation, Lee will talk about the highlights of his exploration career and touch on the role of wires and harnesses on the most memorable spacecraft.

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