The Global Electronics Association has signed a Memorandum of Understanding (MoU) with the Fraunhofer Group for Microelectronics to help accelerate the path from advanced packaging innovation to industry-scale manufacturing.

The Global Electronics Association and MIMOS Berhad recently signed a Memorandum of Understanding (MoU) to collaborate in strengthening Malaysia’s electronics and semiconductor ecosystem, with a focus on advanced electronic packaging (AEP), industry alignment, and global best practices.

The Global Electronics Association on November 4 signed a Memorandum of Understanding (MOU) with the Korea Testing Laboratory (KTL) to strengthen cooperation in standardization, validation, certification, and professional training across the electronics industry.