Effects of Substrate Design on Underfill Voiding Using the Low Cost,High Throughput Flip Chip Assembly Process and No-Flow Underfill Materials
The formation of underfill voids is an area of concern in the low cost,high throughput,or “no-flow” flip chip assembly process. This assembly process involves placement of a flip chip device di
.. read more
Event
IPC APEX 2002
Evaluating the Effect of Conformal Coatings in Reducing the Rate of Conductive Anodic Filament Formation
Conductive anodic filament (CAF) formation is a failure mode associated with electronic circuits which operate at high voltage gradients and which are stored under high humidity conditions. Cer
.. read more
Event
IPC APEX 2002
Evaluation of the Comparative Solderability of Lead-free Solders in Nitrogen
Lead-free soldering technology is still in its infancy with technical and cost issues posing major challenges for the industry. It is expected that soldering in a nitrogen atmosphere might over
.. read more
Event
IPC APEX 2002
Evaluation of Two Novel Lead-Free Surface Finishes
Two new electrolytically plated lead-free surface finishes,satin bright tin on nickel and palladium-cobalt on nickel followed by gold flash coating,are evaluated for their wettability,bond stre
.. read more
Event
IPC APEX 2002
Factors Influencing the Optical Performances of Fiber Optic Connectors
Optical connectors are used to connect optical devices to other optical devices or systems. The presence of these optical connectors makes it possible to switch conveniently from one device or
.. read more
Event
IPC APEX 2002
The Formal Development of a Pb-Free Electronics Manufacturing Operation
To successfully navigate the transition from an entrenched Pb-based electronics manufacturing model to a fully integrated Pb-free manufacturing operation will require significant and coordinate
.. read more
Event
IPC APEX 2002