Global Electronics Association Knowledge Hub

The presentation will discuss the problems that many QFN users are dealing with by having flux trapped under the component that is still gooey and conductive and the effect on circuit performan .. read more

QFN’s offer advantages in reducing size and weight and have excellent thermal and electrical Conductivity related to the ground plane. QFN’s also present printing and assembly challenges includ .. read more

Lead-free assembly has introduced many challenges and non-conformances. One of the more troubling non-conformances is “Pad Cratering”. Pad cratering is when the copper pad completely separates .. read more

The purpose of this presentation is to provide considerations for selection of conformal coatings into electronics assembly operations. The types of testing required for selection and use of co .. read more

Recent advances in polymer science and nanomaterials have fueled a frenzy of scientific activity in multifunctional coatings and films. This rich subject area encompasses several scientific dis .. read more

TLPS materials are an attractive alternative to PbSn for IC power device packaging. They provide a low VOC composition,lead free die attach solution that meets the RoHS guidelines. TLPS materia .. read more

There has been increasing interest in the development of capillary ion chromatography (IC) systems and methods for determination of ionic species. The practice of ion chromatography in capillar .. read more

Moisture poses a significant threat to the reliability of microelectronic assemblies,especially for scientific research products that are designed for marine environment and can be attributed a .. read more

The case of processing issues with Electroless Nickel/Immersion Gold (ENIG) is well documented,even as it endures as a very popular surface finish. Certainly the market says that quality ENIG h .. read more

Jetting of liquids is becoming the standard in our industry. MYDATA has developed a unique tool to jet solder paste. This non-contact method of applying solder paste has a large number of advan .. read more

There are a variety of stencil approaches in which the new product process engineer can deal with the assembly of both high solder paste and low solder paste volume in an SMT assembly environme .. read more

Electronic Assemblies are cleaned in order to remove contaminations that may affect yields,service life and reliability. Highly dense interconnects entrap flux residues under the Z-axis. Volati .. read more

Lead-free solder is more than a swap for SnPb and more than simply an alternative alloy. Five years after implementation discussion remains regarding which alloy is the best for which applicati .. read more

With the miniaturization of components in the semiconductor industry,the need for specialized solder pastes with finer powder mesh sizes for package-on-package (PoP) assemblies has become imper .. read more

Executive Summary There are many issues to consider when developing a new circuit material for the PCB industry. It is a given assumption that the new material must be compatible to standard PC .. read more

Companies that have initiated internal resources to obtain compliance data have realized that collecting,and more importantly,maintaining the currency of that data requires more resources than .. read more

- Live Cycle Assessment - Early Product Analysis / “DFX” Challenge - Keys to Scaling #1: Processes and Systems - Systems can Extend “Traditional” LCA - Keys to Scaling #2: Data Exchange Standar .. read more

Pure tin is a common finish for copper hook up wire,coaxial cable,ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports of whisker growth .. read more

Twenty-nine different cells phones have been disassembled,ground up,dissolved and analyzed for elemental content,mainly for information about the metals present in the phones,but also for some .. read more

Compliant press-fit zones apply external mechanical stress to copper and tin surfaces of plated through holes at printed circuit boards during and after performing the press-in process. This ex .. read more

The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniques (i.e.,barri .. read more

Many companies use “one stop testing” as a solution to the test issues in a manufacturing environment rather than discrete “islands of test”. Low volume,high mix electronic manufactures are con .. read more

Test point optimization for the PCB electrical test domain brings the test speed faster for the flying probe tester (FPT), and the fixture cost lower for the fixture type tester. The importance .. read more

The world of spring-loaded test probes and special probes for in-circuit and functional tests have grown tremendously over the past few years. Ever increasing demands for electro mobility appli .. read more

Voids in solder joints are representing one of the main problems especially for power electronics. A low and homogeneous thermal resistance of solder joints is demanded for a quick and uniform .. read more

Prior to committing production boards to vapor phase soldering,we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor phase processe .. read more

A joint project between Flextronics Inc. and North Star Imaging Inc. is being conducted to correlate current x-ray imaging and cross-section analysis of BGA voiding with state of the art high r .. read more

A great deal of work has already been done to determine the equilibrium temperature of a PCB when exposed to a heat source such as the thermal environment of reflow soldering. This study will g .. read more

Working through the New Product Introduction (NPI) flow between the product design and manufacturing is usually a challenging process,with both parties being experts in their own fields and ine .. read more

The reliability,as tested by thermal cycling,of printed wire boards (PWB) are established by three variables; copper quality,material robustness and design. The copper quality was most influent .. read more

Many of the latest SMT assemblies for hand held devices like cell phones present a challenge to process and manufacturing engineers with the introduction of miniature components such as .3 mm C .. read more

Many articles have been published indicating that 60 to 75% of all board assembly problems stem from solder paste printing. The important outcome from the printing process is to get the correct .. read more

The SMT print process is now very mature and well understood. However as consumers continually push for new electronic products,with increased functionality and smaller form factor,the boundari .. read more

Trace impedances are specified and controlled on PCBs as their nominal impedance value and variations are key factors in establishing system I/O bus performance. PCB trace impedances are evalua .. read more

Signal integrity analysis has shown that printed circuit board (PCB) insertion loss is a key factor affecting high speed channel performance. Determining and controlling PCB insertion loss have .. read more

As a result of heightened requirements for quality,integrity and reliability of electronic products,the role of wafer auditing and nondestructive testing of printed circuit boards and electroni .. read more

In PCB industry,Optical Inspection has been grown rapidly in past decades. It is now playing an important role in manufacturing process. Most manufacturers are now using AOI machines to report .. read more

The paper discusses on the problems faced by the Assembly,Test Manufacturing (ATM) plants of Intel Corporation for a certain Tape and Reel Process. The problem is generic across the other siste .. read more

According to Prismark Partners,the use of QFNs is growing faster than any package type except for flip-chip CSPs. Prismark projects that by 2013,32.6 billion QFNs will be assembled worldwide,wh .. read more

Solder voiding in ball grid array (BGA) solder joints has been well characterized and documented in IPC-A-610 and IPC- 7095 which define industry recommended BGA solder workmanship criteria and .. read more

• Inspection of integrated power electronics = sophisticated test task • X-ray inspection based on 2D / 2.5D principles not utilisable • Full 3D inspection with adapted image capturing and reco .. read more

An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturing environment .. read more

Over the past few years a new family of laminate systems has been developed to face the increasing physical demands of withstanding Pb-free soldering processes used in the assembly of RoHS comp .. read more

The continuous progression toward portable,high frequency microelectronic systems has placed high demands on material performance,notably low dielectric constants (Dk),low loss tangent (Df),low .. read more

In this paper,we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package .. read more

While it has long been known that the Cu6Sn5 intermetallic that plays a critical role in the reliability of solder joints made with tin-containing alloys on copper substrates exists in two diff .. read more

No-clean soldering processes dominate the commercial electronics manufacturing world. With the explosion of growth in handheld electronics devices,manufacturers have been forced to look for way .. read more

In an effort to reduce volatile organic compound (VOC) emissions within our environment,policymakers have encouraged and/or mandated that electronics manufacturers change from alcohol-based VOC .. read more

1. What is BIST 2. What is DSL 3. DSL test items 4. Digital & Analog DSL test 5. BIST on DSL 6. Comparison & Benefits .. read more

Boundary-scan (1149.1) technology was originally developed to provide a far easier method to perform digital DC testing to detect intra-IC interconnect assembly faults,such as solder shorts and .. read more