Global Electronics Association Knowledge Hub

To keep up with shrinking system volume requirements for the Internet of Things and wearable devices while maintaining maximum device functionality requires an integrated approach to SoC and Si .. read more

The world of electronics continues to increase functional densities on products. Many of the miniaturization technologies were developed for the consumer market with the smart phone specificall .. read more

In the past 20 yrs the solvent industry has gone through a great deal of change. In the early 1990s,CFC-113 and 1,1,1-trichloroethane were the workhorses of the industry. The Montreal Protocol .. read more

On January 1,2015,nine months from APEX 2014,the production and use restrictions on HCFC-225 will be in effect throughout the United States. This phase out is encompassing in scope. This phase .. read more

Historically,the determination of the concentration of cleaning agent in high precision electronic cleaning baths has depended on any one of several possible measurable parameters. Refractive I .. read more

The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller c .. read more

RoHS legislated restrictions on the materials used in electronics manufacture have imparted significant challenges on the electronics industry since their introduction in 2006. The greatest imp .. read more

The ever expanding growth in the use of insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application. By optimizing the m .. read more

With increasing power loss of electrical components,thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advanc .. read more

There has been recent activity and interest in Laser-Cut Electroform blank foils as an alternative to normal Electroform stencils. The present study will investigate and compare the print perfo .. read more

The goal of this study was to develop a method by which stencil aperture wall quality can be inspected,and the results quantified. Additionally,we hope to establish a correlation between the st .. read more

Stencil nanocoatings have demonstrated significant improvements in numerous aspects of solder paste printing,including print yield,transfer efficiency,print definition and under wipe requiremen .. read more

Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method w .. read more

Pad cratering test methods have been under development with the emergence of this laminate fracture defect mechanism. In additional to ball shear,ball pull,and pin pull testing methods,the acou .. read more

With the electronic industry moving towards lead-free assembly,traditional SnPb-compatible laminates need to be replaced with lead-free compatible laminates that can withstand the higher reflow .. read more

As the Electronic Manufacturing Services (EMS) industry makes a push to bring manufacturing back to the United States it is clear that automation is necessary in order to keep prices competitiv .. read more

In the fast developing electronic industry the demands for production equipment are changing rapidly as well. The industry is looking for both,stable production processes and automated procedur .. read more

The SMT industry’s one constant is change. Standards are continually updated and components are miniaturized for space savings. In addition to the changes that come,the industry is also faced w .. read more

Nanomaterials have shown great promise in various applications including nanoelectronics and devices. However,in order to achieve large-scale nanoelectronics assembly and manufacturing,the deve .. read more

While the density of chip-to-chip and chip-to-package component interconnections increases and their size decreases the ease of manufacture and the interconnection reliability are being reduced .. read more

The Advanced Technology Center of the Lockheed Martin Corporation has developed a nanotechnology enabled copper-based electrical interconnect material that can be processed around 200 °C. The r .. read more

The electrochemical short,Conductive Anodic Filamentation,that that can develop within a PCB can be difficult to diagnose and detect,and there are many material and process issues that can lead .. read more

The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects,the causes of copper barrel cracks in printe .. read more

Conductive filament formation or CAF typically occurs in two steps: degradation of the resin/glass fiber bond followed by an electrochemical reaction. Bond degradation provides a path along whi .. read more

During the last period of newly assembled electrical devices (pcbs),new component types like LGA and QFN were also qualified as well as smaller passive components with reliability requirements .. read more

Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa .. read more

Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa .. read more

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An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the predominance of consumer-type electronics. The continuing trend of increasing .. read more

A novel epoxy flux was developed with good compatibility with no-clean solder pastes,which imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achi .. read more

The electronics market is divided into many segments each having its own challenges; but one theme that connects the electronics community together is a need for higher yield with lower costs. .. read more

Fine pitch/fine feature solder paste printing in PCB assembly has become increasingly difficult as board geometries have become ever more compact. The printing process itself,traditionally the .. read more

As feature sizes are driven to be smaller,the cost of PCB fabrication is driven higher. In particular,sequential lamination of complex circuit boards is a time consuming and expensive process. .. read more

The purpose of this study is to investigate the effect of plasma surface modification to improve adhesion strength between polytetrafluoroethylene (PTFE) and directly plated electroless copper. .. read more

Mr. Craig Herndon & Mr. Roger Smith will be discussing the Navy’s assignment as the DoD Executive Agent for Printed Circuit Board (PrCB) Technology and its role in ensuring that viable military .. read more

Since the late 1990s,the globalization of the electronics industry has put North American and European manufacturers in competition with manufacturers in China and other low-labor-cost areas. .. read more

One of the more notable trends in the data on electronics manufacturing over the past several years has been a return to regionalization. Defined as building in region for region,this trend is .. read more

The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole) connectors and offers a wide process win .. read more

In this study various printed circuit board surface finishes were evaluated,including: organic solderability preservative (OSP),plasma finish (PF),immersion silver (IAg),electroless nickel / im .. read more

This paper is the second of two papers discussing the companies Lower Melt Alloy program. The first paper was presented at IPC APEX2013. The program explores the manufacturability and reliabili .. read more

Low melting 57Bi42Sn1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study,BGAs with SAC105,SAC305,and BiSnAg balls were assembled with SAC105,SAC305 or 57Bi4 .. read more

The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder bal .. read more

As lead-free alloys shift into high reliability electronics,the issue of tin whisker growth remains a primary concern among those in the industry. Current research shows that there is no perfec .. read more

A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. The th .. read more

The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar .. read more

Nowadays,consumer electronic product is characterized with miniature,portable,light and high performance,especially for 3G mobile products. More and more fine pitch CSPs (0.4mm) come forth as t .. read more

Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling,fringe project .. read more

Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been dras .. read more

The number one issue identified by the 2009 iNEMI Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan description language (.bsdl) files from the semiconductor .. read more

The number one issue identified by the 2009 iNEMI Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan description language (.bsdl) files from the semiconductor .. read more