Global Electronics Association Knowledge Hub

Different types of components with soldered bottom terminations are increasingly used in the electronics industry with the principal objective to improve heat dissipation. The larg .. read more

The Semi-Additive Process (SAP) is a standard process to enable very fine lines and spaces to produce highly sophisticated Integrated Circuit Substrates (ICS). When operating with lines and .. read more

The next generation devices using high frequency of 5G to mmWave and greater has called for innovation in materials used in electronics manufacturing to realize the optimum signal integrity .. read more

PCB Fabricators have long since abandoned Hot-Air Levelling, with several alternative final finishes (ImAg, ImSn, OSP, ENIG and ENEPIG) now well established as having a track record of meeti .. read more

Aerospace and defense applications present unique challenges for material suppliers. As increasingly adoption of wide bandgap semiconductor materials and advanced diverse accessible heteroge .. read more

The rapid change to and steep rise of electric vehicles (EV) results in many challenges for the design, manufacturing, testing, and the understanding of reliability and robustness for printe .. read more

“Light weighting” has become an important trend in numerous manufacturing divisions. Lightweight materials are particularly valuable in any portable device including mass transit systems, au .. read more

Selective soldering utilizes wettable metal nozzles for controlled application of solder to components. The wetting of solder to the nozzles is part of a complex mechanism that causes wear o .. read more

Surface mount technology was developed in the 1960s and implemented on printed circuit boards in the 1980s. High-density electronic assemblies are dominated nowadays by surface mount devices .. read more

Advanced implementation of wearables and IOT applications require attachment of components on lightweight, mechanically flexible, and low-cost substrates. Candidate materials that meet these .. read more

Selective electrodeposition (brush plating) was successfully used to rework a solder-contaminated, hard gold-plated copper flag connector for a circuit card assembly (CCA). The localized rep .. read more

The iNEMI flowers of sulfur (FoS) corrosion chamber was developed to study creep corrosion on printed circuit board assemblies(PCBAs). The chamber, typically run at 50 or 60oC, has corrosive .. read more

Environmental dust accumulation on electronic equipment can impact the performance and reliability of the equipment in various ways. This includes mechanical effects (such as obstructions of .. read more

Inspection means have increasingly been incorporated into typical manufacturing of boards, substrates and/or systems. A significant number of automatic inspections rely on the analysis of im .. read more

Digitalization changes everything, everywhere. It is inevitable, new business drivers are forcing the Electronics industry to rethink every element of their business. Virtually every company .. read more

As the reflow soldering process is the main energy consumer in a SMT assembly line, there is a high potential for cost reduction by significantly reducing the amount of energy needed. Meltin .. read more

As miniaturization trends continue in the electronics industry, System in Package (SiP) technology is gaining more and more traction. In many ways, some SiP modules are just surface mount te .. read more

The advance in technology and its relentless develop mentis delivering yet another surface mount assembly challenge. To meet the market demand for products with higher functionality whilst r .. read more

Polymer coating materials protect electronics from harsh environments, assuring safe and reliable performance. To reach the highest level of reliability, coatings must be selectively applied .. read more

The development of an automated circuit card assembly(CCA)conformal coating process using a low outgassing polyurethane material was essential for meeting the increase in customer demand fro .. read more

Light-curable materials can provide significant benefits over conventional technologies, including lower operating costs driven by lower labor needs, space savings, lower energy demand, and .. read more

To support regulations on hazardous substances in materials and in products like the automotive EU End of Life Vehicle (ELV) directive, the Electronics and Electrical Equipment Restriction o .. read more

Until recently, virtually all restricted materials in electronics were classified as either carcinogens (e.g. Pb) or reproductive toxins (e.g. phthalates). Two new categories of restricted m .. read more

The High Density Packaging (HDP) User Group has completed a project based upon an earlier project evaluating the different types of high frequency test methods used in the industry for measu .. read more

Earlier HDP User Group project work that has been completed and published compared the different types of high frequency test methods used in the industry for measuring Dk and Df at high fre .. read more

As electronic assembly designs have increased in density and component packaging size and lead pitch have decreased in size, this has placed tighter requirements on manufacturing processes. .. read more

This slide show presents solutions to the relevant Power Module question: "What has to be considered within a PCB, if currents with about 50 A and voltages above 500 V should be designed?"&n .. read more

The operation and reliability of any electronic assembly is very dependent on the performance, quality and consistency of the bare printed circuit board (PCB). Without good quality bare boar .. read more

A number of similar Printed Wiring Assemblies (PWAs) had been subjected to final electrical tests on automated test equipment when a common test failure was recognized. All PWAs were failing .. read more

SMT-flux residues are feared to be a potential risk factor for quality issues in electronic assembly and interconnect technology. This work shows how the amount of no clean flux residues can .. read more

In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-pa .. read more

ENIG, electroless nickel immersion gold is now a well-regarded finish used to enhance and preserve the solder-ability of copper circuits. EPIG, electroless palladium immersion gold, is a new .. read more

The latest highest reliability requirements demand a high performance electroless nickel and immersion gold (HP ENIG). The new IPC specification 4552A has refocused the industry with referen .. read more

This paper details the realization of a multi-layered, printed, conformable hybrid circuit. The circuit was created using silver(Ag) flake ink as a conductive layer and UV acrylic-based ink .. read more

As is the case with many other markets where faster, highly capable technologies have resulted in more intelligent processes and products, the medical device sector is also undergoing a “sma .. read more

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This Presentation discusses Improvements for signal integrity.  Signal integrity is based on the copper surface roughness, the oxides on the copper, and the Dielectric constant of the D .. read more

This Slide show presents RF Cap Layers to normal FR4 Dielectric materials.  This material can be used in multiple configurations including Single sided, Double sided, and Hybrid.&n .. read more

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remai .. read more

Electronic assembly processes range from simple to complex and involve a wide range of materials to produce. Each step in the process and each assembly material used will have some impact on .. read more

Since the 1970s, ROSE testing was used to determine “clean enough.” In 2015, the J-STD-001 committee assigned a team to develop the next generation of “cleanliness” requirements. Section 8 d .. read more

A nano-Cu pressureless sinterable paste was developed for joint formation applications. The material was further engineered in both chemistry and process for enhanced oxidation resistance. T .. read more

With the advancement in miniaturization, the die is getting thinner and the solder balls are getting smaller for BGAs. Consequently, the thermal warpage is getting more severe due to the mis .. read more

Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is “when we should switch from Ty .. read more

Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping c .. read more

Increased demand for radar capabilities has required increasingly more efficient thermal management techniques. Simple cold plates using tubes or channels are frequently used to cool high po .. read more

Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top .. read more

This presentation covers Stretchable hybrid electronics.  Stretchable electronics have the most industry uses in wearable technology and for mobile sensing and response devices.  T .. read more

This presentation covers additive manufacturing and the direct deposit of multiple metals.  This additive capability is best utilized for the production of complicated circuits such as .. read more

The defense industry has realized the importance of Additive Manufacturing (AM) and how this technology can be utilized where parts can be fabricated inexpensively with reduction in lead tim .. read more