Global Electronics Association Knowledge Hub

On July 1,2006,lead and certain other hazardous materials were banned from most forms of new electronic equipment in the countries of the European Union. Although most aerospace products are no .. read more

As companies transition over to lead-free assembly a certain amount of hand-soldering and rework will be performed. An article from Tech Search International last year did state that in Asia wh .. read more

Lead-free wave soldering requires tighter process control than soldering with lead based alloys. A key area of the machine that impacts the ability to solder lead-free alloys without defects is .. read more

The regulatory measures defined in MIL performance standards that govern production of active and passive electronic components ban the application of pure Sn plated leads for EEE parts. The st .. read more

This paper continues work by Sun Microsystems and the University of Maryland,CALCE[1] to predict plated through via life using laminate material properties,plated copper material properties,and .. read more

As the electronics industry prepares to meet the requirements of the European Community’s RoHS directive on lead in electrical and electronic equipment an issue about which concern is frequentl .. read more

Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress .. read more

Since the issue of the European Union directive [1] on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) and its predecessor WEEE directiv .. read more

A designed experiment evaluated the influence of several variables on visual appearance and strength of Pb-free solder joints. Components,with leads finished with nickel-palladium-gold (NiPdAu) .. read more

As the electronics industry moves toward the implementation of Pb-free soldering,the impact on the assembly process must be considered. One process that is often over looked is the cleaning of .. read more

With the latest legislations from RoHS and WEEE dominating the horizon of the PCB landscape there is a need for manufacturers and their suppliers to understand their impacts. The requirement to .. read more

The deployment of non-Lead (Pb) surface finishes is well underway throughout the electronics industry. Printed circuit boards,which for many years had relied on Hot Air Solder Level (HASL) fini .. read more

As we inch towards the somewhat shifting deadlines towards lead (Pb) restriction in Japan and Europe,there is an increase seen in the amount of studies performed for electronics assemblies sold .. read more

This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle designed to resemble real world manufacturing applications. Four different Pb-free a .. read more

The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process. The largest changes are in the reflow process,as Pb-free pastes requ .. read more