Global Electronics Association Knowledge Hub

Lead-free wave soldering requires tighter process control than soldering with lead based alloys. A key area of the machine that impacts the ability to solder lead-free alloys without defects is .. read more

Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress .. read more

This paper continues work by Sun Microsystems and the University of Maryland,CALCE[1] to predict plated through via life using laminate material properties,plated copper material properties,and .. read more

boards in the in-line aqueous cleaning process. As lead-free circuit boards become more complex and component spacing decreases,the effectiveness of direct blow-off drying is greatly diminished .. read more

As the electronics industry prepares to meet the requirements of the European Community’s RoHS directive on lead in electrical and electronic equipment an issue about which concern is frequentl .. read more

Planar microvoids have been observed on second level interconnections between solder metallizations and copper lands on PCB boards with immersion silver surface finish. These planar microvoids .. read more

During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer .. read more

An important development in high reliability electronics is the convergence of circuit board and advanced packaging technologies. This combination enhances the best attributes of each technolog .. read more

As the electronic industry is moving to lead-free PWB final finishes and high density circuit boards,the widely used PWB finish,SnPb HASL,has to be replaced with a lead-free and coplanar PWB fi .. read more

For some years now,an area ratio of 0.66 or greater has been the criterion for stencil apertures to achieve acceptable volume control in the printed solder paste “brick,” for small apertures Me .. read more

A perplexing challenge for RoHS compliance is adapting large,complex and thick,high-layer count multilayers to lead-free assembly. These are typically dense,complex assemblies with large BGAs a .. read more

With the introduction of lead free electronics assembly worldwide,greater concerns are raised over factory control of materials and processes. Due to the mix of both leaded and lead free produc .. read more

This paper will present seven different materials used for the production of both wave solder and reflow solder pallets. The goal of this study will be for the purpose of depicting machining ca .. read more

This paper analyzes the differences in plated through hole fill performance between the regular OSP and Pb-free OSP PCB surface finish chemistries in a Pb-free wave solder process. The variable .. read more

The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers .. read more

Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The l .. read more

Organic Solderability Preservatives (OSP) continue to attract significant attention as circuit board final finishes. They have evolved from simple and thin benzotriazole coatings to thicker and .. read more

The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers .. read more

This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr .. read more

In this paper,factors that influence the ability for a flex circuit,especially a multilayer flex circuit,to survive the lead-free soldering and other thermal processes during the circuit fabric .. read more

The purpose of this program was to evaluate the solder joint reliability,using the IPC-9701 standard as a guideline,of PCBAs that were assembled with conventional leaded and ROHS compliant lead .. read more

Soldering with lead-free solders has become an international standard. A study conducted by the Dresden Technical University and rehm Anlagenbau examines which influences various parameters hav .. read more

The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in .. read more