Global Electronics Association Knowledge Hub

The technical and economic benefits derived from lowering the reflow temperatures have motivated the evaluation of new Sn-Bi low temperature alloys for soldering. Eutectic Sn-Bi alloy is usu .. read more

In recent years there has been an increased demand for electronic products with high reliability solder alloys having improved performance in thermal cycle resistance for harsh working envir .. read more

DurafuseTM LT paste was designed as an alternative low temperature solder targeting at enabling hierarchy design for portable devices with good temperature cycling and superior drop-shock pe .. read more

This paper compares the thermal cycling performance of a quad flat no-lead (QFN) component and three different ball grid array (BGA) components assembled onto printed circuit board test vehi .. read more

Optimal breakout of ultra-fine-pitch ball grid array (BGA) packages requires a mix of via structures – through and blind mechanical, stacked and staggered laser – often implemented in thicke .. read more

Drive towards lead-free electronics began in the early 2000s. Solder pastes based on tin (Sn), copper (Cu), and silver (Ag) were the initial replacement for the traditional SnPb solder. With .. read more

As lead-free alloys shift into high reliability electronics,the issue of tin whisker growth remains a primary concern among those in the industry. Current research shows that there is no perfec .. read more

Commercial-off-the-shelf column grid array packaging (COTS CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administ .. read more

Conclusions: •Tin/Lead BGAs: The location of the void within the solder joint was the primary root cause for the loss of solder joint integrity. •Lead-free BGAs: The statistical analysis and th .. read more

Although lead-free soldering has been main stream in the industry since 2006,with the replacement of eutectic SnPb system by the Sn/Ag/Cu system,the development of drop-in lead-free alternative .. read more

Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space .. read more

We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal cycle (TC) by varying the thickness of Palladium (Pd) in Electrole .. read more

The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon .. read more

Spontaneously forming tin whiskers,which emerge unpredictably from pure tin surfaces,have regained prevalence as a topic within the electronics research community. This has resulted from the RO .. read more

The High Density Packaging Users Group (HDPUG) Consortium has completed an experiment to investigate the effect of non-filled microvias in SMT solder joint pads and the associated solder voids .. read more

With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010 .. read more

Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents and often with “micro alloying” additions. There are .. read more

For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev .. read more

Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed .. read more

In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains .. read more

Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents. There are numerous perceived reliability benefits to .. read more

With increasing use of portable appliances such as PDA and cellular phone,changing environment of application requires higher solder joint reliability. The Cu-OSP process has been widely used f .. read more

For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev .. read more

RoHS exempt high reliability OEMs breathed a sign of relief for not having to go through the grind of revising their processes and material to be RoHS compliant. However,this was short lived be .. read more

The High Density Packaging Users Group (HDPUG) consortia completed an extensive study of 29 different bare board material and stackup combinations and their associated performance after 6X Pb-f .. read more

The New England Lead Free Consortium,composed of many companies in the electronic supply chain in the regional area and chaired by the author; has embarked on an extensive long term reliability .. read more

This paper discusses the results of several independent experiments designed to address the many aspects of successful PoP integration. Assembly through the use of in-line stacking and pre-stac .. read more

European legislation has meant that lead-free solders now dominate mainstream electronics manufacturing. These replacement solders are all high tin alloys with significantly higher melting poin .. read more

Following the implementation of WEEE legislation,there will be an increasing interest in adopting more sustainable manufacturing processes and materials as targets are increased,and must be ach .. read more

As some of the reliability issues and cost associated with tin silver copper solders become more apparent,alternative pb-free solder formulations are being considered. Of particular interest ar .. read more

Solder joints tend to crack after extended thermal cycling,if the component and the circuit board are CTE mis-matched. Predicting t-cycle lifetime is a crucial first step in optimizing product .. read more

Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol .. read more

Choosing a Thermal Interface Material adhesive can have an impact on the reliability of the microelectronic package in harsh thermal environments where thermal cycling temperature ranges are mo .. read more

In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m .. read more

The motivation for developing higher density IC packaging continues to be the personal entertainment and the portable handset markets. Consumers? expectations are that each new generation of pr .. read more

CTE mismatches during temperature cycling can cause significant movement of components and materials relative to one another,which in turn stresses solder joints and wirebonds. Silicones are of .. read more

The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in .. read more

During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer .. read more

The electronic industry has been migrating to lead-free solder alloys by legislation forces. In Europe the WEEE/RoHS are scheduled to ban Pb alloys in July 2006. China is in process of preparin .. read more

Thermal cycle testing is being conducted by Boeing Phantom Works (Seattle) for the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) No-Lead Solder Project. The J .. read more

Bare printed wiring board materials require changes from today’s typical standard dicy cured FR4 materials in order to support lead-free assembly. The High Density Packaging User’s Group has co .. read more

For this study,researchers from the University of Toronto produced samples of Sn-Pb solder,with additions of bismuth, solidified at controlled cooling rates. The microstructure of the various B .. read more

The New England Lead-free Electronics Consortium is a collaborative effort of New England companies spanning the electronics supply chain,sponsored by the Toxics Use Reduction Institute,the U.S .. read more

Plastic IC Packages are generally considered to be not as reliable as their ceramic counterparts. One of the major reasons is the question of hermeticity. Plastic materials generally allow mois .. read more

The objectives of the present study are to design,fabricate,and test various configurations of micro-vias over military thermal environment,and then evaluate the impacts of micro-via design/man .. read more

The hypothesis that the “whisker growth phenomenon” in electrodeposited tin is a re-crystallization process driven by stress has gained popularity among leading research institutes and industri .. read more

Movements to lead-free assembly are being influenced by legislative and market requirements. Specifically Europe has passed legislation requiring the removal of lead from electronics assembly b .. read more

A variety of mechanical and thermal stress related problems related to Flip Chip Ball Grid Array Packages (FCBGAs) are often solved by the Finite Element Method. Often,the question for the stre .. read more

In this work,we have evaluated the use of underfill to enhance the reliability of small BGAs in the automotive thermal cycling environment. Best parameters for underfilling of BGAs were develop .. read more

Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip interconnection types including anisotropic conductive film or .. read more