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Board Finish Solderability with Sn-Ag-Cu

Lead-free soldering technology is still in its infancy with technical and cost issues posing major challenges for the industry. It is expected that soldering in a nitrogen atmosphere might over .. read more
Author(s)
Chris Hunt,Ling Zou,Sean Adams
Event
IPC APEX 2003
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Wetting of Fresh and Aged Immersion Tin and Silver Surface Finishes by Sn/Ag/Cu Solder

The wetting of alternative PCB surface finishes,including immersion silver (I-Ag) and immersion tin (I-Sn),by Sn/Ag/Cu solder and Sn/Pb solder,was studied in this work,along with electroless ni .. read more
Author(s)
Minna Arra,Dongkai Shangguan,DongJi Xie
Event
IPC APEX 2003
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High Phosphorus ENIG – Highest Resistance Against Corrosive Environment

Over the past years there has been consistent growth in the use of electroless nickel/immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA,CSP,QFP and COB a .. read more
Author(s)
Petra Backus,Sven Lamprecht
Event
IPC APEX 2003
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SMT Assembly Process Comparison of Pb-free Alloy Systems

This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle designed to resemble real world manufacturing applications. Four different Pb-free a .. read more
Author(s)
Shafi Saiyed,Daryl Santos,James A. McLenaghan
Event
IPC APEX 2003
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Surface Finishes,an OEM Perspective

X .. read more
Author(s)
Mike Barbetta
Event
IPC Fall Meetings 2002
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