Global Electronics Association Knowledge Hub

Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The l .. read more

This paper analyzes the differences in plated through hole fill performance between the regular OSP and Pb-free OSP PCB surface finish chemistries in a Pb-free wave solder process. The variable .. read more

The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers .. read more

This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr .. read more

Organic Solderability Preservatives (OSP) continue to attract significant attention as circuit board final finishes. They have evolved from simple and thin benzotriazole coatings to thicker and .. read more

The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers .. read more

Soldering with lead-free solders has become an international standard. A study conducted by the Dresden Technical University and rehm Anlagenbau examines which influences various parameters hav .. read more

Since the issue of the European Union directive [1] on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) and its predecessor WEEE directiv .. read more

A designed experiment evaluated the influence of several variables on visual appearance and strength of Pb-free solder joints. Components,with leads finished with nickel-palladium-gold (NiPdAu) .. read more

As the electronics industry moves toward the implementation of Pb-free soldering,the impact on the assembly process must be considered. One process that is often over looked is the cleaning of .. read more

With the latest legislations from RoHS and WEEE dominating the horizon of the PCB landscape there is a need for manufacturers and their suppliers to understand their impacts. The requirement to .. read more

The deployment of non-Lead (Pb) surface finishes is well underway throughout the electronics industry. Printed circuit boards,which for many years had relied on Hot Air Solder Level (HASL) fini .. read more

As we inch towards the somewhat shifting deadlines towards lead (Pb) restriction in Japan and Europe,there is an increase seen in the amount of studies performed for electronics assemblies sold .. read more

This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle designed to resemble real world manufacturing applications. Four different Pb-free a .. read more

The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process. The largest changes are in the reflow process,as Pb-free pastes requ .. read more