Advanced Electronic Packaging (AEP): A Silicon-to-Systems Approach
Decades of regional and industry specialization made electronics manufacturing highly efficient, but they also created dependencies that are now strategic risks. Chip scaling alone can't meet the performance demands of AI, electrification, and mission-critical systems, so Advanced Electronic Packaging has become the industry's focus. That includes packaging, board architecture, assembly, materials, and system design, and it's where competitive advantage is built and supply chain fragility shows up. This Global Electronics Association report maps that ecosystem as one connected system without favoring any technology or regional strategy. It shows where capabilities are concentrated, where interdependencies create strength or fragility, and how to build resilience across regions. We hope it helps industry and policy leaders understand what lies beyond the semiconductor layer.