Bringing standards-based thinking earlier into rigid-flex design

Nov 03, 2026
Key Summary
  • Integrate IPC standards early in rigid-flex PCB design to support manufacturability, reliability and clearer communication across design, fabrication and assembly teams.
  • Use IPC-2223E, IPC-6013, IPC-2221 and IPC-TM-650 to establish common expectations for printed board design, performance, qualification and testing.
  • Review critical design requirements before fabrication with the Cadence Rigid-Flex PCB Design Review Checklist, covering bend zones, materials, stackup, routing, vias and documentation. The checklist complements—not replaces—IPC standards.
  • Build rigid-flex design expertise with Global Electronics Association resources, including the IPC Design Process Flow, IPC Standards Guidance for Printed Board Assemblies and the six-week PCB Design for Flex & Rigid-Flex Boards course.

By Peter Tranitz, Senior Director, Technology Solutions, Global Electronics Association

Rigid-flex designs are helping electronics manufacturers meet growing demands for smaller, lighter and more reliable products. From aerospace and defense systems to medical devices, industrial electronics, automotive applications and advanced consumer products, rigid-flex technology can provide important advantages in packaging density, weight reduction and interconnect reliability.

But rigid-flex design also raises the stakes.

Compared with traditional rigid printed boards, rigid-flex designs require additional attention to bend zones, material selection, stackup, routing, vias, component placement, testing, reliability and fabrication documentation. Decisions made early in the design process can have significant implications for manufacturability and long-term performance. That is why standards-based thinking needs to be part of the process from the beginning, not added only at final review.

IPC standards provide a foundation for that work. Standards such as IPC-2223E, IPC-6013, IPC-2221 and IPC-TM-650 help establish common expectations for design, performance, qualification and test methods. They also support clearer communication among designers, fabricators, assemblers, suppliers and customers.

To help designers connect that standards foundation to practical application and continued learning, the Global Electronics Association and Cadence are highlighting a set of resources that can support the rigid-flex design process.

The Cadence Rigid-Flex PCB Design Review Checklist provides a practical pre-fabrication verification resource for reviewing critical design considerations before a design is released. It is designed to help teams look carefully at areas such as bend zones, stackup, materials, routing, vias, component placement, analysis, documentation and final design review.

"Rigid-flex design requires balancing electrical performance with mechanical and fabrication constraints. Industry standards provide a foundation, but a structured design review helps engineers evaluate critical design requirements and identify potential issues that could affect fabrication or long-term reliability.” Hani Dekaidek, principal product marketing manager, Cadence. 

The checklist is not a replacement for the underlying IPC standards. Rather, it is a tool to help designers apply standards-based thinking more consistently during review.

For a broader view of where IPC standards fit throughout the printed board design process, designers can also use the Association’s IPC Design Process Flow. This resource maps the design workflow from library creation and design setup through detailed design, documentation and final release, while showing where standards support the process.

The IPC Standards Guidance for Printed Board Assemblies provides another practical reference, helping users identify standards that apply across PCB design, fabrication, assembly, testing and other stages of the product lifecycle.

For designers who want to build deeper practical expertise, the Global Electronics Association also offers PCB Design for Flex & Rigid-Flex Boards. This six-week course focuses on flex and rigid-flex design, manufacturing and assembly techniques, extending the resource pathway from reference and review into structured professional development.

Together, these resources provide a useful path: understand the design process, identify the standards that apply, use a focused checklist to review rigid-flex considerations before fabrication and build deeper capability through formal training.

For the electronics industry, this matters because design complexity is increasing while expectations for reliability, speed and manufacturability continue to rise. When standards are built into the process earlier, teams are better positioned to reduce ambiguity, improve communication and address critical issues before they become costly production challenges.

Rigid-flex design will continue to play an important role in advanced electronics. By combining standards knowledge, practical design-review tools and focused professional development, the industry can support better outcomes for designers, manufacturers and end users alike.

For more information, please contact me at PeterTranitz@electronics.org.