Global Electronics Assembly Report: One segment will drive market to nearly double by 2030
Key Summary
- SiC and GaN adoption is growing: Accuris recorded 1,057 new SiC parts and 141 new GaN parts in 2024.
- Applications differ by voltage: GaN clusters at 650 V and below; SiC dominates higher-voltage applications.
- PCB requirements differ: SiC emphasizes thermal management; GaN requires low-loss materials and short interconnects.
- Lifecycle status matters for sourcing: About 71% of SiC parts and 41% of GaN parts are active.
The Global Electronics Assembly Report, produced by the Global Electronics Association (referred to as the Association), forecasts that the global electronics assembly market’s value will rise from $2.125 trillion in 2025 to $4.038 trillion in 2030. For manufacturers, original equipment manufacturers (OEMs) and suppliers, and for the consultants and investors who advise them, the question is not just how large the market becomes but which parts of it matter to their business.
The report breaks the market into nine demand segments through 2030 and shows who builds the products, so readers can see where growth is concentrated and how it applies to their business. Additionally, the report provides insight into how companies stack up, profiling 120 leading electronics manufacturing services (EMS) providers and original design manufacturers (ODMs). Each profile covers analyses of business models, customers, end markets, recent developments and manufacturing sites, with performance metrics and financial details. For suppliers, that makes it possible to compare their own business with the competition. For OEMs, consultants and investors, it shows who serves which markets, and how.
Front-loaded annual growth peaks in 2026
The forecast projects that the annual growth rate will be front-loaded, peaking at 27.5% in 2026 and moderating to 4.1% by 2030. The early surge reflects value more than volume. Higher memory, storage and processor costs, along with more expensive system configurations, lift assembly value faster than shipments do. These effects will fade as capacity catches up with demand, with pricing for high-value AI data center components stabilizing or declining slightly by 2030.
Cloud and AI are main primary growth catalysts
Cloud and AI Services Infrastructure, meaning servers and enterprise storage, are expected to add $1.19 trillion to assembly value between 2025 and 2030. That is about 62% of all forecasted growth. This demand segment grows from $436 billion to $1.63 trillion, and its share of the overall electronics assembly market nearly doubles.
Below, Figure 1 shows that communications, automotive and industrial lead the way in market growth behind cloud and AI services infrastructure, driven by handset and networking upgrades, more electronics in each vehicle, and investment in automation, test equipment and energy systems. Their shares of the market fall, but their values still grow, and with that growth comes real opportunity for companies in the electronics assembly space.
Figure 1: Global Electronics Assembly Growth Contribution, by Demand Segment, 2025 to 2030 (US$ Billions). Source: Global Electronics Assembly Report
Rising overall assembly value is reflected in semiconductors, materials and components, and manufacturing as well. Accelerated servers need more processing, memory, power, and interconnect hardware. Semiconductors are forecast to grow from $781 billion to $2.07 trillion in global electronics assembly value, while materials and components overall go up to 76.2% of global electronics assembly value. Manufacturing and other value-adds fall as a share of the total, but they still grow 8.7% a year, to $962.8 billion in global electronics assembly value.
AI reaches well beyond the data center
The Association’s Global Electronics Assembly Report also tracks the portion of assembly value tied to AI-enabled hardware-- projected to grow from $441 billion to $1.93 trillion. When people talk about artificial intelligence, they often picture giant data centers with racks of servers as far as the eye can see. While those facilities do account for the most AI-related electronics, the report highlights the numerous technologies that support AI use in everyday products, including phone cameras, laptops that run AI tools on the device, driver-assistance systems, factory machine vision, medical imaging equipment and smart-home gadgets and wearables.
The report further defines qualifying hardware as hardware value attributed to functions using trained AI or machine-learning models, plus qualifying server and storage systems materially configured for training, inference and model serving. An AI-capable processor alone does not qualify for an entire device. Separately sold software and services are excluded; embedded components are counted once within the finished system. The report projects that the share of electronics assembly tied to AI-enabled hardware will more than double by 2030, from roughly one-fifth of the market to nearly half.
Outsourcing nears half the market, but in-house continues to rise
Electronics manufacturing services (EMS) providers and original design manufacturers (ODMs) together are forecast to pass $2 trillion in revenue by 2030, with their share of total assembly value rising to nearly 50%. Despite ODMs growing faster than EMS providers, OEMs that build in-house are not fading out.
OEM output is forecast to reach about $2.02 trillion, holding roughly half of the total value. Outsourcing's rising share is partly the result of products that were already made externally growing faster, not a wholesale move away from in-house production. The report separates the three production sources, so readers can benchmark against comparable businesses.
APAC regional dominance
The Asia-Pacific (APAC) region leads in nearly every demand segment compared with the Americas and the Europe, Middle East and Africa (EMEA) region. In several demand segments, APAC dominates market share. The report adds country-level coverage and company manufacturing sites, a more useful footprint view than headquarters location.
Demand segment | Americas | EMEA | APAC |
|---|---|---|---|
Traditional Computing | 11.8% | 8.4% | 79.9% |
Consumer | 10.6% | 10.1% | 79.3% |
Communications | 13.2% | 9.2% | 77.6% |
Cloud/AI Services & | 17.4% | 8.6% | 74.0% |
Automotive | 18.6% | 20.1% | 61.3% |
Industrial | 20.9% | 21.3% | 57.8% |
Medical | 25.3% | 20.8% | 53.9% |
Commercial Aviation | 28.8% | 21.5% | 49.7% |
Defense & Other | 27.8% | 24.5% | 47.8% |
Table 2: Estimated EMS+ODM Production Revenue and Share, by Region, 2025 (US$ Billions and %). Source: Global Electronics Assembly Report
What could move the forecast
Cloud & AI Services Infrastructure drives most of the forecasted growth, so the outlook depends heavily on server deployment timing, power availability, cooling capacity and component pricing. A shift in any of these factors moves the worldwide total. The 2025 starting point also reflects broader coverage of the EMS and ODM market. The jump from $658.5 billion in 2024 to $970.6 billion in 2025 includes a significant methodology effect and should not be read as market growth alone. The cost-category figures are estimates, not a measured market census.
What the full report adds
The Global Electronics Assembly Report is a full market study in which AI is one important driver. It evaluates nine end markets from the demand side, analyzing more than 80 OEM customers per segment, and checks the results against supplier-level revenue and production footprints. It also profiles 120 leading EMS and ODM suppliers, which together generate an estimated 84.4% of worldwide EMS and ODM revenue. Profiles cover business-model mix, customers, end markets and manufacturing sites, with financial detail where companies disclose it.
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