Chair: Nick Koop, TTM Technologies - San Diego Vice-Chair: Dan Loew, L3Harris Fuzing & Ordnance Systems Staff Liaison(s): Sarah Cobarrubias Email: SarahCobarrubias@electronics.org Committee Charter: This subcommittee is responsible for maintaining IPC-6013, Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards.
