Global Electronics Association Knowledge Hub

During the process from wafer fabrication to completing the final plastic package there are a number of upstream processes that negatively impact subsequent operations. Problems at wirebond can .. weiterlesen

Flip chip bonding is the most desirable direct chip attachment approach for minimizing electronic assembly size as well as improving device performance. For most prototyping applications it is .. weiterlesen

This paper is focused on the impact of solder hole fill on the reliability of the plated-through-hole (PTH) solder joints with different board thicknesses. Finite element analysis (FEA) is empl .. weiterlesen

During the last 5 years,the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new meth .. weiterlesen

Implementation of lead-free soldering technology has created new interest in high performance cleaning of printed circuit assemblies (PCAs). Many studies have been commissioned regarding remova .. weiterlesen

Batch cleaning of electronic assemblies is popular in all regions of the world and continues to grow due to its flexibility,ease-of-use and economic considerations. Batch spray-in-air processes .. weiterlesen

All but the most simple circuit boards processed in recent times are inspected using in-circuit testing,ICT. In order to test on pads or connections printed with no-clean solder paste; the post .. weiterlesen

Due to In-Circuit Test issues probing difficult to penetrate processes such as Pb-free solder,OSP (Organic Solderability Preservative),Immersion Au (Gold),Ag (Silver),Sn (Tin) and No-Clean,as w .. weiterlesen

•Rewards businesses with a dollar for dollar reduction of tax •Rewards “evolutionary” and “revolutionary” activities •Federal tax benefit can be as high as 6.5% of investment in new products an .. weiterlesen

Companies seeking sales or suppliers in the global marketplace must proceed with caution. This presentation provides an overview of U.S. regulation of import and export transactions. Importers .. weiterlesen

Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems,mainly for soldering and cleaning purpose. For most of the lead-free solders,paste handling .. weiterlesen

It is known that pure tin will undergo an allotropic transformation below 13°C where it becomes a semiconductor with a 26% volume increase,and in appearance turns from a bright shiny metallic m .. weiterlesen

Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct .. weiterlesen

An assessment to measure the cleanliness of the area underneath a component has been completed. The assessment uses an 8”×9”×0.093” test vehicle with FR4 laminate,OSP surface finishing,and 21 p .. weiterlesen

Electronics,especially mobile electronic items,are subjected to unintentional abuse by having various beverages spilled onto or into them. Ion Chromatography and emission spectroscopy were used .. weiterlesen

Over 3 years ago,Zestron initially addressed cleaning underneath 4 MIL standoff components. With the emergence of lead-free and even smaller components new challenges have now arisen to include .. weiterlesen

The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D .. weiterlesen

This paper presents lead-free ball grid array (BGA) packages subjected to two ball removal and two ball attachment techniques. Solder attach strength is used as a metric to examine the reballin .. weiterlesen

As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact .. weiterlesen

The use of an insoluble anode in place of standard copper anodes (slab or titanium baskets filled with copper) improves the quality of plating,increases the productivity of the plating line,red .. weiterlesen

The Semiconductor industry is demanding more and more from today’s PWB manufacturers. This paper offers some insights to the needs,requirements,solutions and process verifications that R&D Circ .. weiterlesen

The peel test will be reviewed,with special attention given to deposited adhesiveless copperclad laminates. A basic familiarity with the IPC test method will be assumed. The brief amount of tim .. weiterlesen

We demonstrate here a novel CCL (Copper Clad Laminate) which exhibits an extremely low transmission loss at mm-wave band. The CCL which we developed is based on a new fluoropolymer with adhesiv .. weiterlesen

Over these years,EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trend,signal integrity performance gets more critical upon today’s h .. weiterlesen

Since July 1st 2006,the 2002/95/EC RoHS European directive has forced the electronic industry to switch from Tin-Lead to lead-free soldering alloys for components assembly. Exemption domains ha .. weiterlesen

Although the official implementation of the EU Restriction of Hazardous Substances (RoHS) directive officially started on July 1,2006,a significant portion of the avionics electronics supply ch .. weiterlesen

REACH presents a new set of direct and indirect risks for article manufacturers,including electronics manufacturers. Direct risks arise from obligations explicitly outlined in the REACH regulat .. weiterlesen

Following the implementation of WEEE legislation,there will be an increasing interest in adopting more sustainable manufacturing processes and materials as targets are increased,and must be ach .. weiterlesen

The purpose of this paper is to demonstrate the value of mathematical modeling of PCB processes. This approach will identify the first order variables that control the process and the relative .. weiterlesen

Conductive Anodic Filament(CAF) that is one of the copper migration phenomena becomes significant problem with higher density circuit for printed circuit board.(PCB) In the past CAF property wa .. weiterlesen

Solder joints tend to crack after extended thermal cycling,if the component and the circuit board are CTE mis-matched. Predicting this t-cycle lifetime is critical in optimizing product design .. weiterlesen

The low Ag solder alloy shows higher drop performance than the high Ag solder alloy in the every kind of package and board combinations. This is related to the ductility of solder and the surfa .. weiterlesen

As some of the reliability issues and cost associated with tin silver copper solders become more apparent,alternative pb-free solder formulations are being considered. Of particular interest ar .. weiterlesen

The fabrication of EPAD PWBs have come about in response to the pursuit of reduction in real estate,demand for improved electrical characteristics and higher durability and reliability needs fr .. weiterlesen

In order to meet the never ending desire for smaller and cheaper electronics,many companies are pursuing the use of embedded passive technologies. There are several examples of embedded capacit .. weiterlesen

Phenolic cure of epoxy resins produces high glass transition temperature materials for electrical laminates fabrication. These resins are brittle due to the high crosslink densities. Consequent .. weiterlesen

Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as .. weiterlesen

Embedded passives technology offers high-density high-performance solutions,but needs characterization before becoming a resource in harsh-environment applications. This paper discusses two cri .. weiterlesen

As electronics manufacturing,design and after market services evolve into as a strategic option for today’s electronics original equipment manufacturers (OEM),opportunities for further growth e .. weiterlesen

This paper will compare the current capabilities of raw material suppliers to the PWB industry to those same capabilities 10 and 20 years ago. Key raw materials such as resin,glass fabric,coppe .. weiterlesen

The growth of portable wireless products and related consumer electronics is fueling a major outsourcing effort towards Asia. Most OEM (original equipment manufacturers) are partnering with CMs .. weiterlesen

As the frontiers of feature size and interspace between devices become ever challenging,we as an industry have to start revaluating the performance of the toolsets that are used in the SMT aren .. weiterlesen

As small surface-mount components such as 0201 and 01005 packages have entered volume assembly,manufacturers are observing increased instances of poor solder coalescence during reflow. The root .. weiterlesen

Fine solder powder paste applications continue to grow as a cost effective solution to many semiconductor packaging needs. Applications for solder paste continue to evolve from the standard SMT .. weiterlesen

Rarely do PCB manufacturers have the resources for purchasing an inspection machine for every stage of the manufacturing process. Typically,therefore,they have to decide whether to deploy AOI p .. weiterlesen

It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual Surface Mount Technology (SMT) Manufacturing Processes. In a .. weiterlesen

To select an optimal test strategy,good knowledge of defect levels and test effectiveness are two very important factors to include. In 1999 an industry defect level study was completed and was .. weiterlesen

Prisma is a PCB-Engineering software developed by DYCONEX AG,Switzerland (manufacturer of PCBs). Compared to existing solutions on the market it allows for broad standardization of the process .. weiterlesen

Traceability and process control are no longer requirements reserved for manufacturers in regulatory or specific market segments. Today,all manufacturers who aspire to achieve or to maintain a .. weiterlesen

Lean manufacturing is far from a new concept,and many within the Electronics Assembly (EA) industry are already familiar with the principles and concepts behind it. However,in spite of widespre .. weiterlesen