Global Electronics Association Knowledge Hub

RoHS directives require screening and quantification of certain elements and compounds used in electronics components and parts. X-ray Fluorescence (XRF) technology has emerged as an effective .. weiterlesen

With the enactment of the European Union (EU) ROHS Directive 2002/95/EC (Ref.1),certain electrical and electronic products that are manufactured in or exported to the European Union have restri .. weiterlesen

Increasing operating frequency of IO busses for computing has highlighted the importance of transmission line loss. For FR4 PCB mother boards computing at speeds above 1 GHz this is dominated b .. weiterlesen

A new bifunctional low molecular weight polyphenylene ether (OPE oligophenylene ether) was obtained by the oxidative coupling of 2,2’,3,3’,5,5’-hexamethyl-[1,1’-biphenyl]-4,4’-diol (HMBP hexame .. weiterlesen

While glass fibers are commonly used to reinforce circuit board substrates,they have a high dielectric constant and loss. Cyclic olefin copolymer fibers have a lower dielectric constant and los .. weiterlesen

This paper analyzes the differences in plated through hole fill performance between the regular OSP and Pb-free OSP PCB surface finish chemistries in a Pb-free wave solder process. The variable .. weiterlesen

Organic Solderability Preservatives (OSP) continue to attract significant attention as circuit board final finishes. They have evolved from simple and thin benzotriazole coatings to thicker and .. weiterlesen

The data from the IPC Alternate Finishes Task Group Report “Time,Temperature and Humidity Stress for Final Finish Board Solderability” has been analyzed in a greater depth than in the actual re .. weiterlesen

We present the electrical characterization of our Liquid Crystal Polymer (LCP) at microwave and millimeter frequencies and the applications of LCP to circuit components. We use several methodol .. weiterlesen

In this paper,factors that influence the ability for a flex circuit,especially a multilayer flex circuit,to survive the lead-free soldering and other thermal processes during the circuit fabric .. weiterlesen

The challenge manufactures face when competing in the world marketplace is to offer a product that will meet all performance and functionality expectations without increasing product size or co .. weiterlesen

Copyright,like all other forms of intellectual property,is based on negative rights. A copyright registrant may exclude others from reproducing a given copyrighted work,composing a derivative w .. weiterlesen

Transitioning to offshore sourcing has become a seductive argument for cost reduction. Most managers agree that the impact has been beneficial to the consumer and the trading conglomerates. Thi .. weiterlesen

The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in .. weiterlesen

The RoHS legislation in Europe has far reaching consequences,which necessitates a change in lead coating on component leads. Although some suppliers are using a tin finish,there is a tendency f .. weiterlesen

Oxide alternatives,as well as traditional and reduced oxide chemistries,are coatings or “adhesion promoters” used to enhance the bond between imaged and etched inner layer copper surfaces and t .. weiterlesen

In the printed circuit board industry there are generally two main types of circuit boards; there are rigid printed circuit boards and flexible printed circuit boards. There is a tremendous var .. weiterlesen

Precise control of coating deposition is critical to the application of conformal coatings to selected areas of printed circuit board assemblies. The coating must be applied in a defined patter .. weiterlesen

The level of protection offered by a range of conformal coatings on electronic assemblies has been evaluated. The role of permeability and ion transport is the primary interest. Testing was car .. weiterlesen

In the global Electronic Manufacturing Services (EMS) market,we constantly hear news of the major ("Big 6") players—Foxconn,Flextronics,Sanmina-SCI,Solectron,Celestica,Jabil—as well as others. .. weiterlesen

Research has shown that U.S. companies can realize higher profits over outsourcing by putting their houses in order and finetuning their production processes,with automation being a key contrib .. weiterlesen

The pressure to reduce overall form-factor size in the high volume chassis desktop market is driving the need to integrate components at the system level. Adding to the challenge of size reduct .. weiterlesen

The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f .. weiterlesen

On July 1,2006,lead and certain other hazardous materials were banned from most forms of new electronic equipment in the countries of the European Union. Although most aerospace products are no .. weiterlesen

The regulatory measures defined in MIL performance standards that govern production of active and passive electronic components ban the application of pure Sn plated leads for EEE parts. The st .. weiterlesen

The delamination of electrical grade laminates continues to be a vexing problem for the printed circuit board industry. Laminates are commonly tailored to meet specific thickness and dielectric .. weiterlesen

Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress .. weiterlesen

This paper compares performance of two phosphorus-based flame retardants: poly-(m-phenylene methyl phosphonate) (PPMP) recently introduced to the market and 9,10-dihydro-9-oxa-10-phosphenanthre .. weiterlesen

The Pb-free transition in the electronics industry has seen immersion silver emerge as a leading circuit board finish for RoHS compliant processes and products. It is utilized in a wide cross-s .. weiterlesen

Planar microvoids have been observed on second level interconnections between solder metallizations and copper lands on PCB boards with immersion silver surface finish. These planar microvoids .. weiterlesen

As the electronic industry is moving to lead-free PWB final finishes and high density circuit boards,the widely used PWB finish,SnPb HASL,has to be replaced with a lead-free and coplanar PWB fi .. weiterlesen

A new low cost,simple and repeatable production test method for measuring signal loss of printed wiring board (PWB) interconnects is discussed. The method uses Time Domain Reflectometry (TDR) t .. weiterlesen

As technology progresses,electronic components that do bigger and better things are hitting the market. At the same time,the size of the PCB is shrinking. While circuit board designers could re .. weiterlesen

With the introduction of lead free electronics assembly worldwide,greater concerns are raised over factory control of materials and processes. Due to the mix of both leaded and lead free produc .. weiterlesen

There are many issues to be considered in the manufacturing of state-of-the-art electronic products. Today's electronic devices,whether based on flexible (FPC) or rigid (PCB) printed circuit bo .. weiterlesen

Work on assisting China's Ministry of Information Industry (MII) to assess the performance of a solder paste using the China alloy Sn3.0Ag0.5Cu0.019Ce (SACCe) was completed. Two Indium fluxes w .. weiterlesen

The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers .. weiterlesen

The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers .. weiterlesen

During the solder reflow processes many reactions occur. There is the reduction of oxides on the metal surfaces,metal dissolution,wetting to different surfaces,and intermetallic compound format .. weiterlesen

The purpose of this program was to evaluate the solder joint reliability,using the IPC-9701 standard as a guideline,of PCBAs that were assembled with conventional leaded and ROHS compliant lead .. weiterlesen

The reliability of aged and repaired lead-free and mixed lead-free/lead-based solder interconnects is an important issue for electronic equipment manufacturers. As a result of the global transi .. weiterlesen

The reliability of aged and repaired lead-free and mixed lead-free/lead-based solder interconnects is an important issue for electronic equipment manufacturers. As a result of the global transi .. weiterlesen

New interconnect technologies continue to shrink feature size,increase routing complexity and component density in multilayer rigid and rigid-flex printed circuits. Printed circuit fabricators .. weiterlesen

New interconnect technologies continue to shrink feature size,increase routing complexity and component density in multilayer rigid and rigid-flex printed circuits. Printed circuit fabricators .. weiterlesen

The global electronics industry is exhibiting a widespread and growing interest in the technology of embedded passives. This interest can be attributed to three primary benefits. First,embedded .. weiterlesen

Many techniques have been developed to embed capacitors in printed wiring boards (PWBs) these days. The simplest way may be embedding chip capacitors in PWBs. However,since their thickness is o .. weiterlesen

It has been the conventional wisdom of the industry that the predominate board parameter associated with through hole plating is the aspect ratio of the through hole. While this is intuitively .. weiterlesen

The immersion silver process has become the first choice of final finishing for many original equipment manufacturers (OEM) because of its shortened process flow,good conductivity,even depositi .. weiterlesen

Jobs are becoming more difficult to complete to specifications as the complexity of parts increases. With electronic power components getting more advanced everyday reverse pulse technology is .. weiterlesen

In manufacturing flexible and rigid-flex boards,the metallization step using electroless copper poses a major challenge,namely the leaching of polyimide base material into the plating bath. Lea .. weiterlesen