From System Safety Requirements to Rugged PCB Decisions: A Practical Requirements-to-Evidence Workflow High-reliability electronic products often fall short of their safety and mission objectives because critical assumptions are lost as system requirements are translated into board-level implementation. This virtual event presents a practical workflow for converting mission profiles and hazardous failure effects into measurable requirements, cross-domain allocations, PCB design constraints, embedded diagnostic behaviors, and objective evidence for verification. An anonymized 48-V smart power distribution unit for an autonomous platform will be used as a running example to demonstrate the chain from a channel fault through hardware protection, firmware response, fault containment, reporting, controlled recovery, and verification. This webinar is intended for systems engineers, PCB and electronic hardware designers, embedded software and firmware engineers, reliability and functional safety engineers, verification and test professionals, technical leads, and engineering managers involved in high-reliability electronic products. It will be particularly relevant to professionals working in aerospace and defense, automotive and e-mobility, robotics, autonomous systems, industrial electronics, and other harsh-environment applications. This virtual event is methodology-driven and will not provide clause-by-clause instruction on a specific IPC standard. Where relevant, we may briefly reference IPC-2221C, Generic Standard on Printed Board Design, and IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards, to connect the requirements-to-evidence workflow with established printed-board design and performance considerations.

NEPCON will be held in a region with a high concentration of automotive industry activity. The Global Electronics Association will co‑exhibit with JapanUnix and promote IPC standards. We are also considering a presentation by a Key Opinion Leader from a global supplier with established relations with the Global Electronics Association.

The wire harness industry is constantly evolving with new technology and practices. The 2027 WHMA Annual Global Leadership Summit offers the tools you need to help your business succeed in this fast-changing landscape. WHMA's Annual Global Leadership Summit (formerly the WHMA Annual Conference) is a networking event for executives representing wire harness manufacturers, OEMs and suppliers for companies that build wiring harnesses and cable assemblies.