We are delighted to welcome Adrian Harea of Schaeffler and Michael Schleicher of Semikron-Danfoss to lead a discussion on DfM for EV's high-voltage / high-power applications.

The panel will share techniques for addressing the complexity of components, increased integration, 3D assembly and working with heavy assemblies. They will touch on the constraints of final systems that impact size, weight, configuration and shape. Balancing easy to manufacture with cost and quality is a key backdrop for the discussion. Panelists will present board level and final assembly DFM considerations. 

Our "Road to Reliability" series aims to bring industry leaders together to discuss the hurdles in achieving reliability for new e-mobility technology. We will examine reliability drivers, technology applications, and target lifecycles.

Join us for this informative session to better understand technology gaps, broaden your professional connections, and uncover strategies for meeting reliability objectives.

Moderator: Stanton Rak, SF Rak Company

AI and IPC standards empower future factories - building a new smart manufacturing ecosystem.

IPC Taiwan Member Appreciation Dinner

We can’t wait to welcome you to IPC Builds, September 13-18, 2025 at the Embassy Suites by Hilton Denton Convention Center in Denton, Texas.

 REGISTER | AGENDA | COMMITTEE MEETINGS | CONTACT US | HOTEL & LOCATION

IPC Builds is all about IPC Standards, welcoming your contribution to the industry standards and guidelines relied on by your company, customers, suppliers, and competitors. Newcomers and industry veterans are welcome. Participate and learn more about these critical industry documents.

IPC Standard Development Committees cover a range of topics, including:

The IPC CEMAC (China Electronics Manufacturing Annual Conference), an exclusive event for IPC members, is dedicated to advancing the development and collaboration of the electronics industry. The conference focuses on promoting the adoption and dissemination of quality and technical standards in electronics manufacturing while serving as a high-value, professional, and efficient platform for international exchange built around IPC’s global industry standards.

To enhance international collaboration and drive sustainable development in electronics manufacturing, IPC CEMAC 2025 will center on the theme "Shaping a Sustainable Future." The event invites participants to explore ways to achieve sustainability through technological innovation, efficient resource utilization, and improved production processes. It seeks to promote green, smart manufacturing and effective supply chain management while embedding sustainability into all aspects of electronics manufacturing, supporting the industry’s long-term, healthy growth.

Electronics Manufacturing & Packaging Symposium (EMPS) 2025

Location: 

ESA/ESTEC 

Noordwijk, the Netherlands

Date: 6–9 October 2025

Technical Presentations 

Professional Development Courses

Exhibition

The symposium, organised by the European Space Agency in partnership with IPC will focus on the latest developments in printed circuit boards, electronic assembly and packaging technologies. While space applications remain a core focus, the event also covers high-reliability market segments such as defense, automotive, medical and data infrastructure, which are central to Europe’s electronics manufacturing industry.

This competition is for choosing the Japanese champion to dispatch the world final 2025 with the cooperation of Japan Unix Co., Ltd. Preliminary details (mid-July & August) will be announced around June in their website. And then, only who pass the preliminary is invited to the final at NEPCON NAGOYA (Oct. 29 - 31).

NEPCON NAGOYA is the exhibition held in the center of the manufacturing industry of Japan. Nagoya is a capital city of Aichi prefecture which has Japan's largest automotive-related manufacturing industry cluster. IPC Japan will have its booth and have Japan regional final of IPC hand soldering competition 2024.