The world economy is entering a new chapter marked by uneven growth, persistent inflationary pressures, and shifting trade dynamics. The United States shows resilience, Europe continues to face stagnation risks, and Asia’s mix of advanced and emerging markets is driving both opportunity and volatility.

Join fellow EMS leaders in the region to share industry pain points and solutions.

Celebrate 20 years of pioneering innovation—join us at IMPACT 2025!

Join the Hand Soldering Regional Estonia 2025 Competition, for Students and Professionals, being held 21-23 October 2025, at TalTech University (Main Lobby), Tallinn, Estonia. Competitors will demonstrate their soldering skills on a complex printed circuit board assembly within 60 minutes — for prizes, recognition, and the chance to secure a spot at the IPC Hand Soldering World Championship later in 2025.

Wire bonding remains the dominant chip-interconnection method—and it's not going anywhere soon. This webinar offers a practical overview of modern wire bonding processes, metrology challenges, and emerging materials. Learn about pitch shrinkage demands, direct bonding to Cu on ULK substrates, and innovations like silver and gold-coated palladium copper wires. Explore key bonding techniques including thermosonic, ultrasonic, and thermocompression, plus new options for Cu wire coatings. Perfect for engineers navigating next-gen packaging and reliability.

IPC Standards European Committee Meetings, by Global Electronics Association, to take place 27-30 October, 2025 in Munich, Germany.