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Presentación
Thermo-mechanical Characterization of Next Generation Substrate Like Printed Circuit Board (SLP) Materials
Internet of Things (IoT) adoption pushes the boundaries of Printed Circuit Board (PCB) miniaturization and speed employing more hybrid stack-ups. The complexity of PCB stack up designs,material
.. leer más
Examination of Glass/Epoxy Interfaces in Printed Circuit Boards
Most manufacturers of electronics grade glass fiber reinforcement used in today’s laminates apply treatments to enhance the bonding strength between the inorganic e-glass and the epoxy matrix w
.. leer más
Investigating the Influence of Corner Radius within Rectangular Aperture Designs
The mobile and consumer market is the driving force of the electronics assembly sector,this sector historically has been associated with early adopters of leading edge surface mount technology
.. leer más
Stencil Nano-Coatings - Do They Improve Repeatability and Uniformity in the Print Process
Over the past few years,studies have shown that Nano-coatings can improve solder paste release and reduce underside cleaning in the print process. Many of these studies have focused on print vo
.. leer más
RoHS: 10 Years Later - IT Equipment Corrosion Issues Remain
The European Union RoHS directive took effect in 2006,and of the 6 restricted materials,the elimination of lead from electronic devices took the most development effort and had the worst degrad
.. leer más
Round Robin Evaluation of iNEMI Creep Corrosion Qualification Test
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the creeping of the copper corrosion products across the PCB surfaces to the extent that they may e
.. leer más
Surviving 3K Thermal Cycles with Variable Void Levels
Electronics manufacturers are searching for new lead-free solders that can improve upon SAC305 voiding performance and that exceed the current thermal cycle performance of this solder in harsh
.. leer más
Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175 C
A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb (SACSb),was developed targeted for high reliability with a wide service temperature capability. The alloy exhibited a melting temperature ra
.. leer más
Practical Considerations for PCB Impedance Measurements
It is common for PCBs used for high frequency RF or high speed digital applications,to be tested for an impedance value prior to shipping the board. The controlled impedance board is typically
.. leer más
Hybrid S-Parameters Behavior of Weak and Strong Edge-Coupled Differential Lines on PCBs
Imbalanced weakly and strongly edge-coupled differential pairs on printed circuit boards (PCBs),both microstrip (MS) and stripline (SL),are studied under different conditions using mixed-mode S
.. leer más
Equivalent Capacitance Approach to Obtain Effective Roughness Dielectric Parameters for Copper Foils
Effective Roughness Dielectric (ERD) is a homogeneous lossy dielectric layer of certain thickness with effective (averaged) dielectric parameters. The ERD layer is used to model copper foil rou
.. leer más
Study and Recommendation for Increasing PCB Surface Finish Shelf Life
Storage time allowed between bare printed circuit board manufacturing and assembly is quite limited. Based on an interpretation of IPC standards,shelf-life of the surface finish is the limiting
.. leer más
Solder Joints Failure Under Low Strain-rate Cyclic Loading
Solder joint reliability has been a key issue for electronic assemblies and microelectronic packaging for many years. Many different factors can affect the solder joint reliability,such as pack
.. leer más
A Novel Electroless Nickel Immersion Gold (ENIG) Surface Finish for Better Reliability of Electronic Assemblies
Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to black-pad defects (hyper-corrosion related failures) associated with de-wetting of solder. EN
.. leer más
Jet Printed Solder Paste and Cleaning Challenges
In case of broadband technology,component packages and other devices assembled on the PCBs are ever-shrinking,yet demands for quality,precision and reliability remain the same. Thus,how can man
.. leer más
Monitoring the Cleaning Process using Industry 4.0 Methodology
Assemblers of printed circuit boards seek to provide their customers with high-quality products at the lowest possible cost. The total cost of production must take into account the complete pro
.. leer más
X-ray Inspection of Radiation Sensitive Devices Recommended Best Practices for Preprogramed Managed NAND
Automated X-ray inspection post solder reflow is used to automatically analyze and detect structural defects including solder voids,opens,shorts,insufficient solder and other defects. These def
.. leer más
Electric Field Control - EOS Mystery Solved
A new discovery of missing fundamental controls in electronic manufacturing is the cause for most Electric Overstress failures generated by PCB and cable discharge events. This discovery develo
.. leer más
PCBA Redesigns Done in the Right Way
Electronic component end-of-life (EOL) and declining prices are more problematic to industrial than consumer electronic products. Industrial electronic products typically have long product life
.. leer más
Improved Interoperability Between MCAD and ECAD Design Tools
During the design of printed wiring boards,our engineers exchange files between the MCAD and ECAD tools in order to synchronize boards and to validate the fulfillment of design requirements. Be
.. leer más
Library Management for an Ever-Evolving Diverse EDA Tool Industry
Any company that designs PCBAs that has gone through the throws of an acquisition,CAD tool change or even an EMS company with a varied customer base has to deal with more than one EDA tool and
.. leer más
Semi-Additive Process for Variant Polyimide Substrates in Ultra-Fine Flexible Circuitry
Ultra-fine flexible circuitry has been more and more applied in electronic devices due to their fast innovation and the increasing demand on miniaturization,light weight and flexibility in some
.. leer más
Minimizing Signal Degradation in Flexible PCB Microstrip and Stripline Transmission Lines That Use Cross-Hatched Return Planes
In restricted-space applications,flexible PCBs must be able to fold with especially small bend radii. This in turn requires the return planes associated with microstrip and stripline transmissi
.. leer más
Water Resistant,Sprayable and Dippable Nano-Coatings for Printed Circuit Assemblies
The electronics industry could benefit greatly from low cost,easy to apply coatings that can be applied to almost any PCBA surface in order to provide effective and practical water (damage) res
.. leer más
Development of a High Temperature Protective Coating to Enable Organic Printed Circuit Boards to Operate at Higher Temperatures
Reliable operation of electronics at higher temperatures requires a combination of performance improvements in components,interconnects and substrates. Ceramic based substrate options can be co
.. leer más
Analyzing a Printed Circuit Board Weave Exposure Condition and its Effects on Printed Wiring Assembly Functional Performance
Printed Circuit Board (PCB) weave texture and weave exposure are conditions that may appear similar if appropriate inspection techniques are not applied in a manner that can differentiate betwe
.. leer más
Acoustic Detection of Pad Craters in Mechanical Shock and Transient Bend Tests
Printed circuit assemblies have become more susceptible to a failure mode known as “pad cratering” due to the implementation of several material restrictions. Pad cratering is defined as mechan
.. leer más
Soldering and Plating for Tin-Lead and Lead-Free Connection Reliability
Aerospace Defense High Performance (ADHP) electronics products primarily use tin-lead solders,but electrical and electronic component finishes (i.e.,platings) increasingly are designed for lead
.. leer más
Zero-Fault Production in Soldering Processes: Quality Management Based on Quality Assurance
A production process free from defects,with every production step being reproducible and traceable,is the target of quality assurance in electronics production worldwide. In many cases manual r
.. leer más
Advanced Non-Pressure Silver Sinter Process by Infrared
In Power Electronics,increasing attention are drawn to silver sinter materials as an attractive interconnect material for its properties and also as a lead replacement solution. New property de
.. leer más
Thermo-mechanical Characterization of Next Generation Substrate Like Printed Circuit Board (SLP) Materials
Internet of Things (IoT) adoption pushes the boundaries of Printed Circuit Board (PCB) miniaturization and speed employing more hybrid stack-ups. The complexity of PCB stack up designs,material
.. leer más
Examination of Glass/Epoxy Interfaces in Printed Circuit Boards
Most manufacturers of electronics grade glass fiber reinforcement used in today’s laminates apply treatments to enhance the bonding strength between the inorganic e-glass and the epoxy matrix w
.. leer más
Investigating the Influence of Corner Radius within Rectangular Aperture Designs
The mobile and consumer market is the driving force of the electronics assembly sector,this sector historically has been associated with early adopters of leading edge surface mount technology
.. leer más
Stencil Nano-Coatings - Do They Improve Repeatability and Uniformity in the Print Process
Over the past few years,studies have shown that Nano-coatings can improve solder paste release and reduce underside cleaning in the print process. Many of these studies have focused on print vo
.. leer más
RoHS: 10 Years Later - IT Equipment Corrosion Issues Remain
The European Union RoHS directive took effect in 2006,and of the 6 restricted materials,the elimination of lead from electronic devices took the most development effort and had the worst degrad
.. leer más
Round Robin Evaluation of iNEMI Creep Corrosion Qualification Test
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the creeping of the copper corrosion products across the PCB surfaces to the extent that they may e
.. leer más
Surviving 3K Thermal Cycles with Variable Void Levels
Electronics manufacturers are searching for new lead-free solders that can improve upon SAC305 voiding performance and that exceed the current thermal cycle performance of this solder in harsh
.. leer más
Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175 C
A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb (SACSb),was developed targeted for high reliability with a wide service temperature capability. The alloy exhibited a melting temperature ra
.. leer más
Practical Considerations for PCB Impedance Measurements
It is common for PCBs used for high frequency RF or high speed digital applications,to be tested for an impedance value prior to shipping the board. The controlled impedance board is typically
.. leer más
Hybrid S-Parameters Behavior of Weak and Strong Edge-Coupled Differential Lines on PCBs
Imbalanced weakly and strongly edge-coupled differential pairs on printed circuit boards (PCBs),both microstrip (MS) and stripline (SL),are studied under different conditions using mixed-mode S
.. leer más
Equivalent Capacitance Approach to Obtain Effective Roughness Dielectric Parameters for Copper Foils
Effective Roughness Dielectric (ERD) is a homogeneous lossy dielectric layer of certain thickness with effective (averaged) dielectric parameters. The ERD layer is used to model copper foil rou
.. leer más
Study and Recommendation for Increasing PCB Surface Finish Shelf Life
Storage time allowed between bare printed circuit board manufacturing and assembly is quite limited. Based on an interpretation of IPC standards,shelf-life of the surface finish is the limiting
.. leer más
Solder Joints Failure Under Low Strain-rate Cyclic Loading
Solder joint reliability has been a key issue for electronic assemblies and microelectronic packaging for many years. Many different factors can affect the solder joint reliability,such as pack
.. leer más
A Novel Electroless Nickel Immersion Gold (ENIG) Surface Finish for Better Reliability of Electronic Assemblies
Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to black-pad defects (hyper-corrosion related failures) associated with de-wetting of solder. EN
.. leer más
Jet Printed Solder Paste and Cleaning Challenges
In case of broadband technology,component packages and other devices assembled on the PCBs are ever-shrinking,yet demands for quality,precision and reliability remain the same. Thus,how can man
.. leer más
Monitoring the Cleaning Process using Industry 4.0 Methodology
Assemblers of printed circuit boards seek to provide their customers with high-quality products at the lowest possible cost. The total cost of production must take into account the complete pro
.. leer más
X-ray Inspection of Radiation Sensitive Devices Recommended Best Practices for Preprogramed Managed NAND
Automated X-ray inspection post solder reflow is used to automatically analyze and detect structural defects including solder voids,opens,shorts,insufficient solder and other defects. These def
.. leer más
Electric Field Control - EOS Mystery Solved
A new discovery of missing fundamental controls in electronic manufacturing is the cause for most Electric Overstress failures generated by PCB and cable discharge events. This discovery develo
.. leer más
PCBA Redesigns Done in the Right Way
Electronic component end-of-life (EOL) and declining prices are more problematic to industrial than consumer electronic products. Industrial electronic products typically have long product life
.. leer más
Improved Interoperability Between MCAD and ECAD Design Tools
During the design of printed wiring boards,our engineers exchange files between the MCAD and ECAD tools in order to synchronize boards and to validate the fulfillment of design requirements. Be
.. leer más
Library Management for an Ever-Evolving Diverse EDA Tool Industry
Any company that designs PCBAs that has gone through the throws of an acquisition,CAD tool change or even an EMS company with a varied customer base has to deal with more than one EDA tool and
.. leer más
Semi-Additive Process for Variant Polyimide Substrates in Ultra-Fine Flexible Circuitry
Ultra-fine flexible circuitry has been more and more applied in electronic devices due to their fast innovation and the increasing demand on miniaturization,light weight and flexibility in some
.. leer más
Minimizing Signal Degradation in Flexible PCB Microstrip and Stripline Transmission Lines That Use Cross-Hatched Return Planes
In restricted-space applications,flexible PCBs must be able to fold with especially small bend radii. This in turn requires the return planes associated with microstrip and stripline transmissi
.. leer más
Water Resistant,Sprayable and Dippable Nano-Coatings for Printed Circuit Assemblies
The electronics industry could benefit greatly from low cost,easy to apply coatings that can be applied to almost any PCBA surface in order to provide effective and practical water (damage) res
.. leer más
Development of a High Temperature Protective Coating to Enable Organic Printed Circuit Boards to Operate at Higher Temperatures
Reliable operation of electronics at higher temperatures requires a combination of performance improvements in components,interconnects and substrates. Ceramic based substrate options can be co
.. leer más
Analyzing a Printed Circuit Board Weave Exposure Condition and its Effects on Printed Wiring Assembly Functional Performance
Printed Circuit Board (PCB) weave texture and weave exposure are conditions that may appear similar if appropriate inspection techniques are not applied in a manner that can differentiate betwe
.. leer más
Acoustic Detection of Pad Craters in Mechanical Shock and Transient Bend Tests
Printed circuit assemblies have become more susceptible to a failure mode known as “pad cratering” due to the implementation of several material restrictions. Pad cratering is defined as mechan
.. leer más
Soldering and Plating for Tin-Lead and Lead-Free Connection Reliability
Aerospace Defense High Performance (ADHP) electronics products primarily use tin-lead solders,but electrical and electronic component finishes (i.e.,platings) increasingly are designed for lead
.. leer más
Zero-Fault Production in Soldering Processes: Quality Management Based on Quality Assurance
A production process free from defects,with every production step being reproducible and traceable,is the target of quality assurance in electronics production worldwide. In many cases manual r
.. leer más
Advanced Non-Pressure Silver Sinter Process by Infrared
In Power Electronics,increasing attention are drawn to silver sinter materials as an attractive interconnect material for its properties and also as a lead replacement solution. New property de
.. leer más