Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
Effect of Conformal Coating on Tin Whisker Growth
This paper will present the testing performed to date by Lockheed Martin Missiles and Fire Control on Tin Whisker test coupons. Coupons are representative lead materials and are half coated wit
.. leer más
Whisker Penetration into Conformal Coating
Tin whiskers are needle-like crystals of tin growing from pure tin or high-tin alloy surfaces,which may grow long enough to cause electrical shorts. Conformal coatings provide some protection a
.. leer más
Via Hole Filling Technology for High Density,High Aspect Ratio Printed Wiring Boards Using a High Tg,low CTE Plugging Paste
The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and
.. leer más
Lead Free Assembly Qualification of ALIVH Boards
The migration to lead free reflow is bringing many challenges for the PCB industry. High Tg laminates,stability of materials thru 2X reflows,rework,moisture sensitivity etc. This requires caref
.. leer más
Reliability of Mis-registered HDI Plated Through Holes
Mechanically drilled through holes in PWBs form interconnects between copper layers through the use of copper pads. These pads are larger than the drill diameter to account for such factors as
.. leer más
Determining Area Ratio Rule for Type 4 and Type 5 Solder Paste
Stencil design is one of the key factors in determining how well any particular stencil will print solder paste. Today’s high volume,24 hour a day,seven days a week manufacturing operations req
.. leer más
Process Development and Characterization of the Stencil Printing Process for Small Apertures
The consumer’s interest for smaller,lighter and higher performance electronics products has increased the use of ultra fine pitch packages,such as Flip Chips and Chip Scale Packages,in printed
.. leer más
Investigation into the Mass Imaging aspects of 0.3mm Wafer Level Chip Scale Package solder paste deposition
fast approaching this horizon is the 0.3mm CSP. This device represents a major assembly revolution within the Surface mount assembly (SMT) arena. The implementation of this device will require
.. leer más
Large and Thick Board Lead-Free Wave Soldering Optimization
This paper presents the results of our study on the development and optimization of lead-free wave soldering process for large and thick printed circuit boards (PCB),through multiple designs of
.. leer más
The Evolution of 3D IC Packaging for Portable and Hand Held Electronics
Increased electronic functionality can be achieved through the development of more complex silicon integration but that course generally requires a great deal of capital resources and an excess
.. leer más
Catalytic Ink Printing: the REAL Printed Circuit
Since the beginning of the digital printing era,methods have been sought to employ this knowledge for use in an elegant approach for producing circuitry. As long ago as the early 80s,companies
.. leer más
SELECTION OF WAVE SOLDERING FLUXES FOR LEAD-FREE ASSEMBLY
The process challenges of lead-free wave soldering often require the use of new flux chemistries when compared with the relatively tolerant tin-lead wave soldering process. In some cases,the fl
.. leer más
Flux Application for Lead-Free Wave Soldering
Lead-free wave soldering requires tighter process control than soldering with lead based alloys. A key area of the machine that impacts the ability to solder lead-free alloys without defects is
.. leer más
Measuring the True Wetting Time of Solders
As the electronics industry prepares to meet the requirements of the European Community’s RoHS directive on lead in electrical and electronic equipment an issue about which concern is frequentl
.. leer más
Selection of Wave Soldering Fluxes for Lead Free Assembly
The process challenges of lead free wave soldering often require the use of new flux chemistries when compared with the
relatively tolerant tin-lead wave soldering process. In some cases,the fl
.. leer más
A Symphony of Synergy: How certification to the IECQ HSPM Specification works in concert with Specification works in concert with...
The IPC's Lead Free program addresses one of the 6 Hazardous Substances regulated by the RoHs directive. Certification to the QC 080000,the IECQ HSPM Specification, addresses the other 5 Haza
.. leer más
Confidence in Your Environmental Compliance
Companies are refining their processes to better ensure their compliance with environmental regulations evolving around the world. These processes reflect internal use models and collaborative
.. leer más
Lead Free Implementation in the Global Market
The Restriction of Hazardous Substances (RoHS) directive is requires companies to change the way they design,
manufacture,track,and bring new products into the market. In order to provide the n
.. leer más
Industry Challenges with China Environmental Product Regulations
Since the issue of the European Union directive [1] on the restriction of the use of certain hazardous substances in electrical
and electronic equipment (RoHS) and its predecessor WEEE directiv
.. leer más
Novel High Temperature Resistant OSP Coatings for Lead-free Processing
In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al
.. leer más
Assembly Verification of an Immersion Silver Finish with Enhanced Tarnish Inhibition
New ROHS standards are forcing the electronics industry to find a replacement for leaded surface finishes. Even more
rapidly than the legislative decision to move away from lead,electronics wer
.. leer más
Observations on the Influences of Various Parameters on Pb-free Solder Joint Appearance and Strength
A designed experiment evaluated the influence of several variables on visual appearance and strength of Pb-free solder joints.
Components,with leads finished with nickel-palladium-gold (NiPdAu)
.. leer más
C4NP Lead Free vs. Electroplated High Lead Solder Bumps
There are various C4 (Controlled Collapse Chip Connection) solder bumping technologies used in volume production. These
include electroplating,solder paste printing,evaporation and the direct a
.. leer más
“Lessons Learned from Seven Years Experience of Lead Free Wave Soldering”
Although in Europe and North America wave soldering is widely regarded as a process that is being rendered obsolete by reflow processes the proliferation of electronic circuitry has more than c
.. leer más
Lead free Defects and Process Yields – Real Case Studies on How Assemblers are preventing them and Maintaining Yields
The industry is in full transition towards lead-free assembly. Due to the different physical,mechanical and chemical
properties of lead-free solder alloys,transitioning lead-free soldering with
.. leer más
Improving Joint Quality with Nitrogen
Nitrogen inerting has been widely reported to reduce defects in lead-free reflow soldering. However,many solder pastes
available claim that they either do not need nitrogen or work equally well
.. leer más
The Effect of Filling VIA-In-Pad-On Voiding Rates in PWB Assembly for BGA Components
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize
voiding,particularly with the advent of lead-free processing and in fine f
.. leer más
Multilayer Board Thermal Robustness: Proposed New Test Method for Evaluating the Thermal Robustness of Multilayer Boards
Many existing and some new laminate material test methods that are being proven useful for determining a laminate material's suitability for use in higher temperature lead-free assembly process
.. leer más
Effect of Conformal Coating on Tin Whisker Growth
This paper will present the testing performed to date by Lockheed Martin Missiles and Fire Control on Tin Whisker test coupons. Coupons are representative lead materials and are half coated wit
.. leer más
Whisker Penetration into Conformal Coating
Tin whiskers are needle-like crystals of tin growing from pure tin or high-tin alloy surfaces,which may grow long enough to cause electrical shorts. Conformal coatings provide some protection a
.. leer más
Via Hole Filling Technology for High Density,High Aspect Ratio Printed Wiring Boards Using a High Tg,low CTE Plugging Paste
The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and
.. leer más
Lead Free Assembly Qualification of ALIVH Boards
The migration to lead free reflow is bringing many challenges for the PCB industry. High Tg laminates,stability of materials thru 2X reflows,rework,moisture sensitivity etc. This requires caref
.. leer más
Reliability of Mis-registered HDI Plated Through Holes
Mechanically drilled through holes in PWBs form interconnects between copper layers through the use of copper pads. These pads are larger than the drill diameter to account for such factors as
.. leer más
Determining Area Ratio Rule for Type 4 and Type 5 Solder Paste
Stencil design is one of the key factors in determining how well any particular stencil will print solder paste. Today’s high volume,24 hour a day,seven days a week manufacturing operations req
.. leer más
Process Development and Characterization of the Stencil Printing Process for Small Apertures
The consumer’s interest for smaller,lighter and higher performance electronics products has increased the use of ultra fine pitch packages,such as Flip Chips and Chip Scale Packages,in printed
.. leer más
Investigation into the Mass Imaging aspects of 0.3mm Wafer Level Chip Scale Package solder paste deposition
fast approaching this horizon is the 0.3mm CSP. This device represents a major assembly revolution within the Surface mount assembly (SMT) arena. The implementation of this device will require
.. leer más
Large and Thick Board Lead-Free Wave Soldering Optimization
This paper presents the results of our study on the development and optimization of lead-free wave soldering process for large and thick printed circuit boards (PCB),through multiple designs of
.. leer más
The Evolution of 3D IC Packaging for Portable and Hand Held Electronics
Increased electronic functionality can be achieved through the development of more complex silicon integration but that course generally requires a great deal of capital resources and an excess
.. leer más
Catalytic Ink Printing: the REAL Printed Circuit
Since the beginning of the digital printing era,methods have been sought to employ this knowledge for use in an elegant approach for producing circuitry. As long ago as the early 80s,companies
.. leer más
SELECTION OF WAVE SOLDERING FLUXES FOR LEAD-FREE ASSEMBLY
The process challenges of lead-free wave soldering often require the use of new flux chemistries when compared with the relatively tolerant tin-lead wave soldering process. In some cases,the fl
.. leer más
Flux Application for Lead-Free Wave Soldering
Lead-free wave soldering requires tighter process control than soldering with lead based alloys. A key area of the machine that impacts the ability to solder lead-free alloys without defects is
.. leer más
Measuring the True Wetting Time of Solders
As the electronics industry prepares to meet the requirements of the European Community’s RoHS directive on lead in electrical and electronic equipment an issue about which concern is frequentl
.. leer más
Selection of Wave Soldering Fluxes for Lead Free Assembly
The process challenges of lead free wave soldering often require the use of new flux chemistries when compared with the
relatively tolerant tin-lead wave soldering process. In some cases,the fl
.. leer más
A Symphony of Synergy: How certification to the IECQ HSPM Specification works in concert with Specification works in concert with...
The IPC's Lead Free program addresses one of the 6 Hazardous Substances regulated by the RoHs directive. Certification to the QC 080000,the IECQ HSPM Specification, addresses the other 5 Haza
.. leer más
Confidence in Your Environmental Compliance
Companies are refining their processes to better ensure their compliance with environmental regulations evolving around the world. These processes reflect internal use models and collaborative
.. leer más
Lead Free Implementation in the Global Market
The Restriction of Hazardous Substances (RoHS) directive is requires companies to change the way they design,
manufacture,track,and bring new products into the market. In order to provide the n
.. leer más
Industry Challenges with China Environmental Product Regulations
Since the issue of the European Union directive [1] on the restriction of the use of certain hazardous substances in electrical
and electronic equipment (RoHS) and its predecessor WEEE directiv
.. leer más
Novel High Temperature Resistant OSP Coatings for Lead-free Processing
In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al
.. leer más
Assembly Verification of an Immersion Silver Finish with Enhanced Tarnish Inhibition
New ROHS standards are forcing the electronics industry to find a replacement for leaded surface finishes. Even more
rapidly than the legislative decision to move away from lead,electronics wer
.. leer más
Observations on the Influences of Various Parameters on Pb-free Solder Joint Appearance and Strength
A designed experiment evaluated the influence of several variables on visual appearance and strength of Pb-free solder joints.
Components,with leads finished with nickel-palladium-gold (NiPdAu)
.. leer más
C4NP Lead Free vs. Electroplated High Lead Solder Bumps
There are various C4 (Controlled Collapse Chip Connection) solder bumping technologies used in volume production. These
include electroplating,solder paste printing,evaporation and the direct a
.. leer más
“Lessons Learned from Seven Years Experience of Lead Free Wave Soldering”
Although in Europe and North America wave soldering is widely regarded as a process that is being rendered obsolete by reflow processes the proliferation of electronic circuitry has more than c
.. leer más
Lead free Defects and Process Yields – Real Case Studies on How Assemblers are preventing them and Maintaining Yields
The industry is in full transition towards lead-free assembly. Due to the different physical,mechanical and chemical
properties of lead-free solder alloys,transitioning lead-free soldering with
.. leer más
Improving Joint Quality with Nitrogen
Nitrogen inerting has been widely reported to reduce defects in lead-free reflow soldering. However,many solder pastes
available claim that they either do not need nitrogen or work equally well
.. leer más
The Effect of Filling VIA-In-Pad-On Voiding Rates in PWB Assembly for BGA Components
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize
voiding,particularly with the advent of lead-free processing and in fine f
.. leer más
Multilayer Board Thermal Robustness: Proposed New Test Method for Evaluating the Thermal Robustness of Multilayer Boards
Many existing and some new laminate material test methods that are being proven useful for determining a laminate material's suitability for use in higher temperature lead-free assembly process
.. leer más