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Presentación
Dispensing Solder Paste Micro-Deposits to 0.2mm – A Process Solution
Solder paste dispensing is not a new process. However,today’s microelectronics present a daunting array of technical
challenges to meet deposit size requirements. The need for better paste form
.. leer más
Jetting- a New Paradigm in Dispensing
Today’s advanced packages for electronics are required to meet a wide range of requirements for reliability,size and cost.
Surface mount technology still prevails in low cost electronics (telev
.. leer más
Solution Processed High Capacitance Nanocomposite Dielectric for Printed Electronics Applications
Since early last decade,scientists had succeeded in applying printing-related technologies to create organic field
effect transistors (OFETs) with micron-sized features. This has led to a wide-
.. leer más
Substrate with Combined Embedded Capacitance and Resistance for Better Electrical Performance and Higher Integration
Many articles have been published on the benefit of thin substrates for use as embedded capacitor layers as well as thin film
resistive material for embedded resistors. Until now the utilizatio
.. leer más
An Analytical Analysis of the Discharge of a Buried Sheet Capacitor Using a LCR Analogy
Buried sheet capacitance has been used for sometime in sophisticated PCB designs. The ZBC 2000TM patented by the
Sanmina Corporation is a familiar example. Conceptually,this product consists of
.. leer más
Embedded Passives Go for It!
The trend towards miniaturization has been with us for quite a while,with marketing departments pressuring for ever-smaller
dimensions for everything. A question that arises frequently in this
.. leer más
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. leer más
Comparison of Types III,IV and V Solder Pastes
A brand name Pb-free solder paste made with three different sizes of solder paste spheres was studied. The soldering ability
of Types III,IV and V solder paste in terms of opens,shorts,solder s
.. leer más
Understanding Stencil Requirements for a Lead Free Mass Imaging Process
Many words have been written about the impending lead free transition,during this period of frantic discovery lots has
been communicated about the reflow and alloy concerns; But the print proce
.. leer más
Optimization of Lead Free SMT Reflow & Rework Process Window
Elevated SMT reflow temperatures for Pb-free soldering are placing excessive thermal demands on certain families of
electronic components. The High Density Package Users Group,HDPUG,Consortium
.. leer más
Accelerated Reliability Testing and Analysis of Lead Free Solder Interconnects
The Pb-free solder interconnect reliability performance of a wide variety of common SMT component types was measured in
an IPC-9701 TC1 thermal cycle (0-100°C / 40 min cycle). Seventeen differe
.. leer más
Via (Plated Through Hole) Integrity with Lead Free Soldering
Bare printed wiring board materials require changes from today’s typical standard dicy cured FR4 materials in order to
support lead-free assembly. The High Density Packaging User’s Group has co
.. leer más
JCAA/JG-PP No-Lead Solder Project: Vibration Test
Vibration testing was conducted by Boeing Phantom Works (Seattle) for the Joint Council on Aging Aircraft/Joint Group on
Pollution Prevention (JCAA/JG-PP) No-Lead Solder Project. The JCAA/JG-PP
.. leer más
Salt Atmosphere,Temperature Humidity,Mechanical Shock Environmental Stress Testing Results,and FMA of the JG-PP / JCAA Lead Free Soldering Program
The American Competitiveness Institute (ACI) performed a series of Environmental Stress Tests for the Joint Group of
Pollution Prevention / Joint Council of Aging Aircraft (JG-PP / JCAA) Lead F
.. leer más
Fluxless Sn-Ag Solder Joints between Silicon and Ag-Cladded Copper with Reliability Evaluations--MEJ
A fluxless bonding process between silicon and copper using Sn-rich Ag-Sn-Au multilayer composite has been developed.
The copper substrate is plated with a silver layer as stress buffer. We bon
.. leer más
Flux Activator Disappearance on Two Circuit Board Substrates
The kinetics of activator disappearance were investigated for a wave-soldering flux containing two activators,succinic and
glutaric acids. Three loadings of flux were applied to bare FR4 panels
.. leer más
Overcoming the Complexity of Flex and Rigid Flex Design
Flexible printed circuits are a growing technology both in terms of numbers and in technology advancement. Applied as
cabling harness technology,IC packaging and as replacement for rigid board
.. leer más
Adhesiveless Copper on Polyimide Flexible Substrates and Interconnects for Medical Applications
Flexible circuit interconnects for ultrasound transducer applications are among the most difficult to fabricate and make good
representative circuits for medical applications. The polyimide die
.. leer más
Microstructure and Properties of Sn-Pb Solder Joints with Sn-Bi Finished Components
For this study,researchers from the University of Toronto produced samples of Sn-Pb solder,with additions of bismuth,
solidified at controlled cooling rates. The microstructure of the various B
.. leer más
Visual and Reliability Testing Results of Circuit Boards Assembled with Lead Free Components,Soldering Materials and Processes in a Simulated Production...
The New England Lead-free Electronics Consortium is a collaborative effort of New England companies spanning the
electronics supply chain,sponsored by the Toxics Use Reduction Institute,the U.S
.. leer más
Reliability of Partially Filled SAC305 Through-Hole Joints
Consistently achieving acceptable wave solder through-hole fill on thick boards is a well-known process challenge,but the
introduction of lead free solders has created additional difficulties.
.. leer más
Automating Tolerance to Process Variation
No two printed circuit boards look exactly alike. Even across two adjacent boards on an assembly line,one can find
significant differences arising out of normal process variation – the componen
.. leer más
Analysis of AXI Test on Fine Pitch Components between Lead Free and Tin/Lead Assembly
By now,most people in the industry understand how complex it is to convert a factory from using a Tin-Lead (Eutectic)
Solder process to a Lead Free process. The implementation of this change re
.. leer más
Prediction of Digital Circuit Board Reliability Using Computational Reliability Modeling
A process called computational reliability modeling is described herein as well as how the reliability predictions from this
modeling approach match experimental data (both lead and lead-free s
.. leer más
A Proposed Mechanism and Remedy for Ball-in-Socket and Foot-in-Mud Soldering Defects on Ball Grid Array and Quad Flat Pack Components
A common source of defects on area array components is the “ball-in-socket” (or “pillowhead”) defect. This defect is
defined as one or more connections that show physical contact but no wetting
.. leer más
Effect of Voiding on Solder Joint Shock and Thermal Cycle Reliability
Solder joint void has been considered a typical phenomenon in electronics assembly. Voids are caused by entrapped gases
produced during flux volatilization during SMT,air entrapment in plated t
.. leer más
Building Reliability into the PWB: Optimization of the Desmear and Metalization Processes for Use on High Frequency and Lead Free...
High Frequency and Lead-Free laminate materials are finding increased use in the PWB fabrication industry driven by end
user requirements for high-speed signal transmission and lead-free solder
.. leer más
Peelable Solder Masks – New Formulations for Today’s Challenges
When manufacturing printed wiring boards and assemblies it is often necessary to cover certain areas prior to soldering operations in order to avoid them being wetted with solder. Such areas ma
.. leer más
Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production
With the latest legislations from RoHS and WEEE dominating the horizon of the PCB landscape there is a need for
manufacturers and their suppliers to understand their impacts. The requirement to
.. leer más
Production Experience and Performance Characterization of a Novel Immersion Silver
Following previous reports by the authors on the general properties of a novel immersion silver process,this paper presents
the production experience in typical horizontal lines to demonstrate
.. leer más
Dispensing Solder Paste Micro-Deposits to 0.2mm – A Process Solution
Solder paste dispensing is not a new process. However,today’s microelectronics present a daunting array of technical
challenges to meet deposit size requirements. The need for better paste form
.. leer más
Jetting- a New Paradigm in Dispensing
Today’s advanced packages for electronics are required to meet a wide range of requirements for reliability,size and cost.
Surface mount technology still prevails in low cost electronics (telev
.. leer más
Solution Processed High Capacitance Nanocomposite Dielectric for Printed Electronics Applications
Since early last decade,scientists had succeeded in applying printing-related technologies to create organic field
effect transistors (OFETs) with micron-sized features. This has led to a wide-
.. leer más
Substrate with Combined Embedded Capacitance and Resistance for Better Electrical Performance and Higher Integration
Many articles have been published on the benefit of thin substrates for use as embedded capacitor layers as well as thin film
resistive material for embedded resistors. Until now the utilizatio
.. leer más
An Analytical Analysis of the Discharge of a Buried Sheet Capacitor Using a LCR Analogy
Buried sheet capacitance has been used for sometime in sophisticated PCB designs. The ZBC 2000TM patented by the
Sanmina Corporation is a familiar example. Conceptually,this product consists of
.. leer más
Embedded Passives Go for It!
The trend towards miniaturization has been with us for quite a while,with marketing departments pressuring for ever-smaller
dimensions for everything. A question that arises frequently in this
.. leer más
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. leer más
Comparison of Types III,IV and V Solder Pastes
A brand name Pb-free solder paste made with three different sizes of solder paste spheres was studied. The soldering ability
of Types III,IV and V solder paste in terms of opens,shorts,solder s
.. leer más
Understanding Stencil Requirements for a Lead Free Mass Imaging Process
Many words have been written about the impending lead free transition,during this period of frantic discovery lots has
been communicated about the reflow and alloy concerns; But the print proce
.. leer más
Optimization of Lead Free SMT Reflow & Rework Process Window
Elevated SMT reflow temperatures for Pb-free soldering are placing excessive thermal demands on certain families of
electronic components. The High Density Package Users Group,HDPUG,Consortium
.. leer más
Accelerated Reliability Testing and Analysis of Lead Free Solder Interconnects
The Pb-free solder interconnect reliability performance of a wide variety of common SMT component types was measured in
an IPC-9701 TC1 thermal cycle (0-100°C / 40 min cycle). Seventeen differe
.. leer más
Via (Plated Through Hole) Integrity with Lead Free Soldering
Bare printed wiring board materials require changes from today’s typical standard dicy cured FR4 materials in order to
support lead-free assembly. The High Density Packaging User’s Group has co
.. leer más
JCAA/JG-PP No-Lead Solder Project: Vibration Test
Vibration testing was conducted by Boeing Phantom Works (Seattle) for the Joint Council on Aging Aircraft/Joint Group on
Pollution Prevention (JCAA/JG-PP) No-Lead Solder Project. The JCAA/JG-PP
.. leer más
Salt Atmosphere,Temperature Humidity,Mechanical Shock Environmental Stress Testing Results,and FMA of the JG-PP / JCAA Lead Free Soldering Program
The American Competitiveness Institute (ACI) performed a series of Environmental Stress Tests for the Joint Group of
Pollution Prevention / Joint Council of Aging Aircraft (JG-PP / JCAA) Lead F
.. leer más
Fluxless Sn-Ag Solder Joints between Silicon and Ag-Cladded Copper with Reliability Evaluations--MEJ
A fluxless bonding process between silicon and copper using Sn-rich Ag-Sn-Au multilayer composite has been developed.
The copper substrate is plated with a silver layer as stress buffer. We bon
.. leer más
Flux Activator Disappearance on Two Circuit Board Substrates
The kinetics of activator disappearance were investigated for a wave-soldering flux containing two activators,succinic and
glutaric acids. Three loadings of flux were applied to bare FR4 panels
.. leer más
Overcoming the Complexity of Flex and Rigid Flex Design
Flexible printed circuits are a growing technology both in terms of numbers and in technology advancement. Applied as
cabling harness technology,IC packaging and as replacement for rigid board
.. leer más
Adhesiveless Copper on Polyimide Flexible Substrates and Interconnects for Medical Applications
Flexible circuit interconnects for ultrasound transducer applications are among the most difficult to fabricate and make good
representative circuits for medical applications. The polyimide die
.. leer más
Microstructure and Properties of Sn-Pb Solder Joints with Sn-Bi Finished Components
For this study,researchers from the University of Toronto produced samples of Sn-Pb solder,with additions of bismuth,
solidified at controlled cooling rates. The microstructure of the various B
.. leer más
Visual and Reliability Testing Results of Circuit Boards Assembled with Lead Free Components,Soldering Materials and Processes in a Simulated Production...
The New England Lead-free Electronics Consortium is a collaborative effort of New England companies spanning the
electronics supply chain,sponsored by the Toxics Use Reduction Institute,the U.S
.. leer más
Reliability of Partially Filled SAC305 Through-Hole Joints
Consistently achieving acceptable wave solder through-hole fill on thick boards is a well-known process challenge,but the
introduction of lead free solders has created additional difficulties.
.. leer más
Automating Tolerance to Process Variation
No two printed circuit boards look exactly alike. Even across two adjacent boards on an assembly line,one can find
significant differences arising out of normal process variation – the componen
.. leer más
Analysis of AXI Test on Fine Pitch Components between Lead Free and Tin/Lead Assembly
By now,most people in the industry understand how complex it is to convert a factory from using a Tin-Lead (Eutectic)
Solder process to a Lead Free process. The implementation of this change re
.. leer más
Prediction of Digital Circuit Board Reliability Using Computational Reliability Modeling
A process called computational reliability modeling is described herein as well as how the reliability predictions from this
modeling approach match experimental data (both lead and lead-free s
.. leer más
A Proposed Mechanism and Remedy for Ball-in-Socket and Foot-in-Mud Soldering Defects on Ball Grid Array and Quad Flat Pack Components
A common source of defects on area array components is the “ball-in-socket” (or “pillowhead”) defect. This defect is
defined as one or more connections that show physical contact but no wetting
.. leer más
Effect of Voiding on Solder Joint Shock and Thermal Cycle Reliability
Solder joint void has been considered a typical phenomenon in electronics assembly. Voids are caused by entrapped gases
produced during flux volatilization during SMT,air entrapment in plated t
.. leer más
Building Reliability into the PWB: Optimization of the Desmear and Metalization Processes for Use on High Frequency and Lead Free...
High Frequency and Lead-Free laminate materials are finding increased use in the PWB fabrication industry driven by end
user requirements for high-speed signal transmission and lead-free solder
.. leer más
Peelable Solder Masks – New Formulations for Today’s Challenges
When manufacturing printed wiring boards and assemblies it is often necessary to cover certain areas prior to soldering operations in order to avoid them being wetted with solder. Such areas ma
.. leer más
Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production
With the latest legislations from RoHS and WEEE dominating the horizon of the PCB landscape there is a need for
manufacturers and their suppliers to understand their impacts. The requirement to
.. leer más
Production Experience and Performance Characterization of a Novel Immersion Silver
Following previous reports by the authors on the general properties of a novel immersion silver process,this paper presents
the production experience in typical horizontal lines to demonstrate
.. leer más