Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
A Comparison Study on Sn3.5Ag and Sn3.8Ag0.7Cu C5 Lead Free Solder System
A comparison study was carried out with Sn3.5Ag and Sn3.8Ag0.7Cu solder balls on Ball Grid Array (BGA) components
with Cu/Ni/Au pad finishing. This study shows that Sn3.5Ag C5 solder system per
.. leer más
Investigating and Characterizing Reduced Whisker Growth from a Bright Pure Tin Process
The implementation of both RoHS and WEEE Directives by the European Union (EU) mandate that electrical and electronic
products put on the market within the EU shall contain restrictive amounts
.. leer más
Tin Pest,A Review
With the transition to high tin solders,and 100% tin finishes,some concerns have been raised about the possible occurrence
of “Tin Pest”. This paper reviews the historical and recent data colle
.. leer más
Effect of Voiding on Lead Free Reliability
This paper had as an aim to correlate the degree of voiding with reliability. Here the a purpose designed test vehicle was
used,in which seven different solder pastes from three manufacturers w
.. leer más
Environmental Compliance Documentation: What’s Next?
Companies not only need to understand the reliability issues with environmental compliance,but also the process of documenting the product’s compliance. Examples will be made – but whose proces
.. leer más
Lead Free 0201 Assembly and Thermal Cycle/Aging Reliability
The many challenges with 0201 passive component assembly can be attributed to the solder paste volume,pad design,
aperture design,board finish,type of solder paste,pick-and-place,and reflow pro
.. leer más
PCB Design and Assembly Process Development of 01005 Components with Lead Free Solder
The continuing demand for smaller,lighter multifunctional portable electronic products has driven the use of miniature
components. To satisfy this demand,01005 chip components are now commercia
.. leer más
S0201 Process and Yield Improvement During Launch to Production
Part miniaturization is inevitable in surface mount assembly. With each shift to smaller component types,new critical process
parameters emerge and old process parameters become significantly m
.. leer más
A Comparison of Small Discretes and Polymer Thick Film Embedded Resistors for Mobile Phone Applications
As an increasing amount of functionality is crammed into today's mobile phones,designers must find ways to save
board area. Two common solutions are the use of embedded passives and the use of
.. leer más
Dielectric Constant and Dissapation Factor of Fr4 Laminates Produced Using Specific Vendors of Fiberglass Yarn
Currently there is not a specification within the IPC for the DK and DF of E-Glass reinforcements and there is no
requirement to report the DK and DF of the glass formulation used to produce E-
.. leer más
Thin and Elastic Substrates for Ultrathin Multilayer Boards
New substrates for ultrathin multilayer boards consist of ultrathin glass fabric and a novel low elastic modulus thermosetting
resin system. They are composed of various lineups with the same r
.. leer más
Novel Toughening Agents for Thermosetting Systems for PWB Base Materials
The proposed revision of IPC 4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards contains
new slash sheets describing FR-4 base materials compatible with lead-free a
.. leer más
The Effect of Processing,Glass Finish,and Rheology on the Interlaminar Shear Strength of a Woven e-Glass Reinforced Polymer Matrix Composite
Laminated woven glass reinforced polymer matrix composites (PMC) are commonly used in the electronics industry as a
robust and effective substrate for circuit boards. In such applications,relia
.. leer más
Single Ball Reballing and Repair of BGA Components
The trend of increasing complication in the rework arena continues. Sources of today’s rework challenges include the
development of smaller and smaller components and the continued difficulty o
.. leer más
Lead Free BGA Rework: A comparison of the effect on reliability of reworked BGAs that have been processed with solder...
The use of the Area Array Package and in particular,Ball Grid Array (BGA) technology in the electronics industry continues
to increase due to the fact that this package type allows for a greate
.. leer más
A Novel Approach to Evaluate the Impact on Solder Joint Reliability due to Multiple BGA Rework
PCB assemblies with numerous BGAs often go through multiple BGA reworks but there is not much data to suggest its effect
on the long term solder joint reliability of the BGAs. This study is foc
.. leer más
Thin Sn over Ni: A Practical and Effective Whisker Mitigation Strategy for Leadframe
As the electronic industry shifts to lead-free manufacturing,Sn whisker remains a key reliability concern. Several whisker
mitigation strategies have been adopted by the component manufactures,
.. leer más
iNEMI Recommendations on Lead Free Finishes for Components Used in High-Reliability Products
This document is intended to help manufacturers minimize the risk of failures from tin whiskers. It is the consensus of the
iNEMI User Group that pure tin electroplating presents a risk in high
.. leer más
Bumping BGA’s Using Solder Paste Printing Process for RFI Shields Packaging
One manufacturing process used to attach RFI shields for medical applications/cellular phone circuit board assemblies
consists of “snapping” the shell-like shields onto solder spheres that are
.. leer más
Ribbon Bonding For RF Applications
As wireless products use higher frequencies and demand higher density packaging solutions,the roles of electrical
interconnects and substrate technologies become increasingly important. Flip ch
.. leer más
Thermoplastic Electronic Packaging: Low Cost – High Versatility
Thermoplastics have started to gain acceptance in some of the more challenging areas of advanced packaging,including
MEMS,where lower cost,cavity style packages are required. Thermoplastics,lik
.. leer más
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. leer más
Effect of Lead Free Assembly Reflow Cycles on Base Material Substrate Properties
Regulatory restrictions and environmental needs are moving the electronics industry towards lead-free solders and other
environmentally friendly materials. This massive effort has resulted in n
.. leer más
Lead Free Soldering: Impact on Laminates Requirements
Different legislations or draft directives target the restriction or the ban of the use of lead in the world. The law banning
lead-bearing electronic products (with a few exemptions) in the Eur
.. leer más
New Phosphorus-Based Curing Agent for Copper Clad Laminates
A new organophosphorus curing agent,Fyrol PMP,specially designed for electronic thermoset resins was recently
introduced to the market. This paper describes the chemical structure and physical
.. leer más
Cleaning Lead Free prior to Conformal Coating? Risks and Implications
Cleaning prior to conformal coating ensures optimal adhesion. In fact,a number of contaminations that are created during the
soldering steps significantly impair the cross linkage and can be sa
.. leer más
Applied Research for Optimizing Process: Parameters for Cleaning Pb-Free Flux
As the electronics industry moves toward the implementation of Pb-free soldering,the impact on the assembly process must
be considered. One process that is often over looked is the cleaning of
.. leer más
A Comparison Study on Sn3.5Ag and Sn3.8Ag0.7Cu C5 Lead Free Solder System
A comparison study was carried out with Sn3.5Ag and Sn3.8Ag0.7Cu solder balls on Ball Grid Array (BGA) components
with Cu/Ni/Au pad finishing. This study shows that Sn3.5Ag C5 solder system per
.. leer más
Investigating and Characterizing Reduced Whisker Growth from a Bright Pure Tin Process
The implementation of both RoHS and WEEE Directives by the European Union (EU) mandate that electrical and electronic
products put on the market within the EU shall contain restrictive amounts
.. leer más
Tin Pest,A Review
With the transition to high tin solders,and 100% tin finishes,some concerns have been raised about the possible occurrence
of “Tin Pest”. This paper reviews the historical and recent data colle
.. leer más
Effect of Voiding on Lead Free Reliability
This paper had as an aim to correlate the degree of voiding with reliability. Here the a purpose designed test vehicle was
used,in which seven different solder pastes from three manufacturers w
.. leer más
Environmental Compliance Documentation: What’s Next?
Companies not only need to understand the reliability issues with environmental compliance,but also the process of documenting the product’s compliance. Examples will be made – but whose proces
.. leer más
Lead Free 0201 Assembly and Thermal Cycle/Aging Reliability
The many challenges with 0201 passive component assembly can be attributed to the solder paste volume,pad design,
aperture design,board finish,type of solder paste,pick-and-place,and reflow pro
.. leer más
PCB Design and Assembly Process Development of 01005 Components with Lead Free Solder
The continuing demand for smaller,lighter multifunctional portable electronic products has driven the use of miniature
components. To satisfy this demand,01005 chip components are now commercia
.. leer más
S0201 Process and Yield Improvement During Launch to Production
Part miniaturization is inevitable in surface mount assembly. With each shift to smaller component types,new critical process
parameters emerge and old process parameters become significantly m
.. leer más
A Comparison of Small Discretes and Polymer Thick Film Embedded Resistors for Mobile Phone Applications
As an increasing amount of functionality is crammed into today's mobile phones,designers must find ways to save
board area. Two common solutions are the use of embedded passives and the use of
.. leer más
Dielectric Constant and Dissapation Factor of Fr4 Laminates Produced Using Specific Vendors of Fiberglass Yarn
Currently there is not a specification within the IPC for the DK and DF of E-Glass reinforcements and there is no
requirement to report the DK and DF of the glass formulation used to produce E-
.. leer más
Thin and Elastic Substrates for Ultrathin Multilayer Boards
New substrates for ultrathin multilayer boards consist of ultrathin glass fabric and a novel low elastic modulus thermosetting
resin system. They are composed of various lineups with the same r
.. leer más
Novel Toughening Agents for Thermosetting Systems for PWB Base Materials
The proposed revision of IPC 4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards contains
new slash sheets describing FR-4 base materials compatible with lead-free a
.. leer más
The Effect of Processing,Glass Finish,and Rheology on the Interlaminar Shear Strength of a Woven e-Glass Reinforced Polymer Matrix Composite
Laminated woven glass reinforced polymer matrix composites (PMC) are commonly used in the electronics industry as a
robust and effective substrate for circuit boards. In such applications,relia
.. leer más
Single Ball Reballing and Repair of BGA Components
The trend of increasing complication in the rework arena continues. Sources of today’s rework challenges include the
development of smaller and smaller components and the continued difficulty o
.. leer más
Lead Free BGA Rework: A comparison of the effect on reliability of reworked BGAs that have been processed with solder...
The use of the Area Array Package and in particular,Ball Grid Array (BGA) technology in the electronics industry continues
to increase due to the fact that this package type allows for a greate
.. leer más
A Novel Approach to Evaluate the Impact on Solder Joint Reliability due to Multiple BGA Rework
PCB assemblies with numerous BGAs often go through multiple BGA reworks but there is not much data to suggest its effect
on the long term solder joint reliability of the BGAs. This study is foc
.. leer más
Thin Sn over Ni: A Practical and Effective Whisker Mitigation Strategy for Leadframe
As the electronic industry shifts to lead-free manufacturing,Sn whisker remains a key reliability concern. Several whisker
mitigation strategies have been adopted by the component manufactures,
.. leer más
iNEMI Recommendations on Lead Free Finishes for Components Used in High-Reliability Products
This document is intended to help manufacturers minimize the risk of failures from tin whiskers. It is the consensus of the
iNEMI User Group that pure tin electroplating presents a risk in high
.. leer más
Bumping BGA’s Using Solder Paste Printing Process for RFI Shields Packaging
One manufacturing process used to attach RFI shields for medical applications/cellular phone circuit board assemblies
consists of “snapping” the shell-like shields onto solder spheres that are
.. leer más
Ribbon Bonding For RF Applications
As wireless products use higher frequencies and demand higher density packaging solutions,the roles of electrical
interconnects and substrate technologies become increasingly important. Flip ch
.. leer más
Thermoplastic Electronic Packaging: Low Cost – High Versatility
Thermoplastics have started to gain acceptance in some of the more challenging areas of advanced packaging,including
MEMS,where lower cost,cavity style packages are required. Thermoplastics,lik
.. leer más
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. leer más
Effect of Lead Free Assembly Reflow Cycles on Base Material Substrate Properties
Regulatory restrictions and environmental needs are moving the electronics industry towards lead-free solders and other
environmentally friendly materials. This massive effort has resulted in n
.. leer más
Lead Free Soldering: Impact on Laminates Requirements
Different legislations or draft directives target the restriction or the ban of the use of lead in the world. The law banning
lead-bearing electronic products (with a few exemptions) in the Eur
.. leer más
New Phosphorus-Based Curing Agent for Copper Clad Laminates
A new organophosphorus curing agent,Fyrol PMP,specially designed for electronic thermoset resins was recently
introduced to the market. This paper describes the chemical structure and physical
.. leer más
Cleaning Lead Free prior to Conformal Coating? Risks and Implications
Cleaning prior to conformal coating ensures optimal adhesion. In fact,a number of contaminations that are created during the
soldering steps significantly impair the cross linkage and can be sa
.. leer más
Applied Research for Optimizing Process: Parameters for Cleaning Pb-Free Flux
As the electronics industry moves toward the implementation of Pb-free soldering,the impact on the assembly process must
be considered. One process that is often over looked is the cleaning of
.. leer más