Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
Adhesiveless Copper on Polyimide Substrate with Nickel-Chromium Tiecoat
Adhesiveless copper on polyimide substrates are used extensively for high density,flexible circuit applications. A
typical construction includes the polyimide substrate,a thin vacuum deposited
.. leer más
Advanced Conductive Adhesive for Interconnect of Solder/Sn-Terminated Components in Flexible Circuitry: A Case Study
Solder is used in polyimide-based flexible circuits for interconnect applications. But it cannot be used with polyester
and epoxy based substrates because of the low temperature tolerance of th
.. leer más
An Alternate Oxide
A new oxide chemistry has been developed which
solves many of the annoying properties of the
currently available alternate oxides. The process is
simple to operate,even simpler to maintain,requ
.. leer más
Application of Thermal Analysis Techniques to Determine Performance Entitlement of Base Materials through Assembly
Multiple soldering assembly steps are essentially
standard for PWBs based on current technologies and
needs. A variety of tests are currently in use to
evaluate the performance of finished PWBs
.. leer más
Aqueous Base Compatible Waveguide Materials for Optical Interconnect Applications
There are a number of organic,inorganic,and hybrid inorganic waveguide materials that are currently being used for
a wide variety of optical interconnect applications. Depending upon the approa
.. leer más
Automated Optical Inspection (AOI) - A Yield Management Solution for the High Density Interconnection (HDI) - Flexible Circuit Industry
The information age has arrived. A growing percentage of the Earth’s population now has access to pagers,cellular
phones,computers,personal digital assistants (PDA’s),and a host of other electr
.. leer más
Benchmarking PCB Process Capability,Quality and Reliability Becomes a Reality
The IPC-PCQR2 (Process Capability,Quality and Relative Reliability) program has developed a library of process
capability panel designs,and a database that details the manufacturing capability,
.. leer más
BGA Mounting Using Improved Solder Columns
BGAs are usually solder-reflowed on substrates,which are frequently made of a different material than that of the
BGAs,which results in a TCE Mismatch between the components. If such an assembl
.. leer más
CAF Property Investigation by Estimating Resin Systems and Resin/Fiber Interface
Copper migration such as conductive anodic filaments (CAF) has become a serious problem for printed wiring
boards (PWBs). As the relation between CAF and matrix resin properties is not clear,th
.. leer más
CAF Resistant,Reinforced Microvia Dielectrics
This paper discusses the results of Conductive Anodic Filament (CAF) testing of three types of reinforced microvia
dielectrics using a CAF test specific Printed Circuit Board (PCB). Quantitativ
.. leer más
CAM Automation: Solution to the Need for Speed and Accuracy
In the best selling book “Who Moved My Cheese”,
author Spencer Johnson tells the story of four
characters—mice named Sniff,Scurry,Hem and
Haw--who are in search of cheese within a maze.
Once th
.. leer más
Characterization of Environment-Friendly Halogen-Free Materials for radio Frequency Electronics Use
Increasing global interest in environmental protection is leading to a higher demand for halogen-free materials that can be
used as the base materials for the printed wiring boards (PWBs) in el
.. leer más
Combination Grid – Prober Test
Combination grid-prober (CGP) testing is being
employed with increasing frequency as the density of
SMD lands on boards continues to increase. A
number of factors are at work. Grid testers,as a
.. leer más
A Comparative Study of PWB’s Containing Halogenated and Halogen Free Flame-Retardants
In order to evaluate the relative merits of halogenated and alternative flame-retardants used in PWB’s,a comparison
between several different PWB’s each having different flame-retardant package
.. leer más
Comparison of High-Tg-FR-4 Base Materials
Customer demands concerning thermal stability of PCB base materials are increasing. Rising complexity of
printed circuit boards requires an improved quality of the dielectric in terms of cleanl
.. leer más
Component Specific PCB Registration Characterization
Predicting printed circuit board (PCB) thickness has not historically been a difficult task. With lower layer count
boards you can afford for the prediction per layer to be wrong by a relativel
.. leer más
Cone vs. Fan Nozzles: Practical Aspects for Spray Processing of High Density Circuits
Horizontal conveyorized spray processing is the most prevalent method for the production of circuit panels in the
industry today. However,as line and space requirements fall below 4 mils (100µm
.. leer más
Current Carrying Capability of Electrically Conductive Adhesives for High Power Applications
Various Ag-filled epoxies were subjected to a current carrying capability study in which current was applied to the
epoxies at temperatures of up to 170°C for 1008 hours. Test devices with Ag e
.. leer más
Current Carrying Capacity in Printed Circuits,Past,Present and Future
In the present as in the past,printed circuit board conductors are sized using simple charts that are a function of
cross-sectional area,current level and conductor temperature rise. These char
.. leer más
What to Look for From Your Board Supplier When Changing to an Alternate Surface Finish to HASL
Over the last five to eight years the use of HASL alternatives by the OEM’s and CM’s has increased dramatically,particularly in response to increasing board density and the need for a solderabl
.. leer más
What the EMS Provider wants in a Board Finish
There are many board finishes in use today and the EMS provider must learn to use many,if not all of them. However,all board finishes do not perform the same during assembly and test operations
.. leer más
Trimming Embedded Resistors
The increased need for smaller,faster,and cheaper electronics has led the microelectronics industry to explore a number of new enabling technologies. Embedding passive components into multi-lay
.. leer más
Fundamentals of Buried Passive Components
Several factors are driving the need for buried passive components in printed circuit boards and chip carriers. Increasing frequency increases the difficulty in quieting noise by the use of sur
.. leer más
The Electronic Considerations of Embedded Passive Components in Optical PCB Fabrication
The current technology includes transmission of between optical units (typically modulated laser sender and receiver units) and fiber optic cables or flexible kapton fiber optic cables with whi
.. leer más
Manufacturing Embedded Resistors
Increasing component density and the requirements of higher performance electronic devices are driving the development of embedded passive devices in the printed circuit board (PCB). The benefi
.. leer más
New Non-Reinforced Substrates for use as Embedded Capacitors
As CPUs increase in performance,the number of passive components on the surface of the boards are increasing dramatically. To reduce the number of components,as well as improve the electrical p
.. leer más
Adhesiveless Copper on Polyimide Substrate with Nickel-Chromium Tiecoat
Adhesiveless copper on polyimide substrates are used extensively for high density,flexible circuit applications. A
typical construction includes the polyimide substrate,a thin vacuum deposited
.. leer más
Advanced Conductive Adhesive for Interconnect of Solder/Sn-Terminated Components in Flexible Circuitry: A Case Study
Solder is used in polyimide-based flexible circuits for interconnect applications. But it cannot be used with polyester
and epoxy based substrates because of the low temperature tolerance of th
.. leer más
An Alternate Oxide
A new oxide chemistry has been developed which
solves many of the annoying properties of the
currently available alternate oxides. The process is
simple to operate,even simpler to maintain,requ
.. leer más
Application of Thermal Analysis Techniques to Determine Performance Entitlement of Base Materials through Assembly
Multiple soldering assembly steps are essentially
standard for PWBs based on current technologies and
needs. A variety of tests are currently in use to
evaluate the performance of finished PWBs
.. leer más
Aqueous Base Compatible Waveguide Materials for Optical Interconnect Applications
There are a number of organic,inorganic,and hybrid inorganic waveguide materials that are currently being used for
a wide variety of optical interconnect applications. Depending upon the approa
.. leer más
Automated Optical Inspection (AOI) - A Yield Management Solution for the High Density Interconnection (HDI) - Flexible Circuit Industry
The information age has arrived. A growing percentage of the Earth’s population now has access to pagers,cellular
phones,computers,personal digital assistants (PDA’s),and a host of other electr
.. leer más
Benchmarking PCB Process Capability,Quality and Reliability Becomes a Reality
The IPC-PCQR2 (Process Capability,Quality and Relative Reliability) program has developed a library of process
capability panel designs,and a database that details the manufacturing capability,
.. leer más
BGA Mounting Using Improved Solder Columns
BGAs are usually solder-reflowed on substrates,which are frequently made of a different material than that of the
BGAs,which results in a TCE Mismatch between the components. If such an assembl
.. leer más
CAF Property Investigation by Estimating Resin Systems and Resin/Fiber Interface
Copper migration such as conductive anodic filaments (CAF) has become a serious problem for printed wiring
boards (PWBs). As the relation between CAF and matrix resin properties is not clear,th
.. leer más
CAF Resistant,Reinforced Microvia Dielectrics
This paper discusses the results of Conductive Anodic Filament (CAF) testing of three types of reinforced microvia
dielectrics using a CAF test specific Printed Circuit Board (PCB). Quantitativ
.. leer más
CAM Automation: Solution to the Need for Speed and Accuracy
In the best selling book “Who Moved My Cheese”,
author Spencer Johnson tells the story of four
characters—mice named Sniff,Scurry,Hem and
Haw--who are in search of cheese within a maze.
Once th
.. leer más
Characterization of Environment-Friendly Halogen-Free Materials for radio Frequency Electronics Use
Increasing global interest in environmental protection is leading to a higher demand for halogen-free materials that can be
used as the base materials for the printed wiring boards (PWBs) in el
.. leer más
Combination Grid – Prober Test
Combination grid-prober (CGP) testing is being
employed with increasing frequency as the density of
SMD lands on boards continues to increase. A
number of factors are at work. Grid testers,as a
.. leer más
A Comparative Study of PWB’s Containing Halogenated and Halogen Free Flame-Retardants
In order to evaluate the relative merits of halogenated and alternative flame-retardants used in PWB’s,a comparison
between several different PWB’s each having different flame-retardant package
.. leer más
Comparison of High-Tg-FR-4 Base Materials
Customer demands concerning thermal stability of PCB base materials are increasing. Rising complexity of
printed circuit boards requires an improved quality of the dielectric in terms of cleanl
.. leer más
Component Specific PCB Registration Characterization
Predicting printed circuit board (PCB) thickness has not historically been a difficult task. With lower layer count
boards you can afford for the prediction per layer to be wrong by a relativel
.. leer más
Cone vs. Fan Nozzles: Practical Aspects for Spray Processing of High Density Circuits
Horizontal conveyorized spray processing is the most prevalent method for the production of circuit panels in the
industry today. However,as line and space requirements fall below 4 mils (100µm
.. leer más
Current Carrying Capability of Electrically Conductive Adhesives for High Power Applications
Various Ag-filled epoxies were subjected to a current carrying capability study in which current was applied to the
epoxies at temperatures of up to 170°C for 1008 hours. Test devices with Ag e
.. leer más
Current Carrying Capacity in Printed Circuits,Past,Present and Future
In the present as in the past,printed circuit board conductors are sized using simple charts that are a function of
cross-sectional area,current level and conductor temperature rise. These char
.. leer más
What to Look for From Your Board Supplier When Changing to an Alternate Surface Finish to HASL
Over the last five to eight years the use of HASL alternatives by the OEM’s and CM’s has increased dramatically,particularly in response to increasing board density and the need for a solderabl
.. leer más
What the EMS Provider wants in a Board Finish
There are many board finishes in use today and the EMS provider must learn to use many,if not all of them. However,all board finishes do not perform the same during assembly and test operations
.. leer más
Trimming Embedded Resistors
The increased need for smaller,faster,and cheaper electronics has led the microelectronics industry to explore a number of new enabling technologies. Embedding passive components into multi-lay
.. leer más
Fundamentals of Buried Passive Components
Several factors are driving the need for buried passive components in printed circuit boards and chip carriers. Increasing frequency increases the difficulty in quieting noise by the use of sur
.. leer más
The Electronic Considerations of Embedded Passive Components in Optical PCB Fabrication
The current technology includes transmission of between optical units (typically modulated laser sender and receiver units) and fiber optic cables or flexible kapton fiber optic cables with whi
.. leer más
Manufacturing Embedded Resistors
Increasing component density and the requirements of higher performance electronic devices are driving the development of embedded passive devices in the printed circuit board (PCB). The benefi
.. leer más
New Non-Reinforced Substrates for use as Embedded Capacitors
As CPUs increase in performance,the number of passive components on the surface of the boards are increasing dramatically. To reduce the number of components,as well as improve the electrical p
.. leer más