Winners of Hand Soldering Competition Vietnam 2026 Announced
The Global Electronics Association hosted the Hand Soldering Competition Vietnam 2026 in conjunction with VIMF 2026 and NEPCON ASIA Vietnam 2026, with the Southern Regional Round held June 17–18 in Ho Chi Minh City and the Northern Regional Round held August 5–7 in Hanoi, Vietnam.
Global Electronics Association Brings IPC Builds Standards Development Event to Paris
The global electronics industry will gather in Paris this September to help shape the standards that define how electronics are designed, built, tested and trusted worldwide.
Global Electronics Association Strengthens Taiwan Technical Leadership in Advanced Electronic Packaging
As advanced electronic packaging becomes increasingly important to enabling next-generation semiconductor innovation, including chiplet architectures, 3D integration, and advanced substrate technologies, the Global Electronics Association announced the appointment of Jeffrey ChangBing Lee as Technology Solutions Lead Expert for Advanced Electronic Packaging (AEP) – Taiwan.
Global Electronics Association Releases IPC-A-630A for Electronic Box Assemblies
The Global Electronics Association has released IPC-A-630A, Requirements and Acceptance for Electronic Box Assemblies, an updated standard providing acceptance criteria for electronic box assemblies
North American EMS Shipments Rise 6.7% in June as Book-to-Bill Reaches 1.33
The Global Electronics Association announced today the June 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.33.
PCB Industry Momentum Continues with 12% Shipment Growth and Strong Book-to-Bill
The Global Electronics Association announced today the June 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.49.