Global Electronics Association Brings IPC Builds Standards Development Event to Paris

Industry experts will advance electronics standards for traceability, sustainability data, connected factories, high-speed electronics and next-generation manufacturing

The global electronics industry will gather in Paris this September to help shape the standards that define how electronics are designed, built, tested and trusted worldwide.

The Global Electronics Association will host IPC Builds, Sept. 19–24, 2026, bringing together engineers, manufacturers, suppliers, technical experts and standards leaders for a week of standards development committee meetings focused on the future of electronics manufacturing.

Committee meetings will cover foundational IPC standards used throughout the global supply chain as well as emerging areas such as digital traceability, Connected Factory Exchange, supplier declaration data flows, CO₂e reporting, high-speed/high-frequency materials, printed electronics, additive manufacturing and advanced reliability.

Why it matters 

IPC standards are used globally by electronics manufacturers and suppliers to establish common expectations for quality, reliability, acceptability, materials, processes and performance. At IPC Builds, industry professionals do the technical work of updating existing standards and developing new frameworks to keep pace with changing technologies, market needs and regulatory pressures.

“Electronics manufacturers are facing new expectations around sustainability, data exchange, traceability, quality and reliability,” said Matt Kelly, chief technology officer and vice president of standards and technology solutions, Global Electronics Association. “IPC Builds gives the people closest to these challenges a direct role in shaping the standards the industry depends on.”

The Paris event comes as European manufacturers and suppliers navigate increasing requirements related to product carbon footprint, digital product passports, supply chain transparency, advanced manufacturing and interoperability across connected production environments.

Committee meetings will address topics across the full electronics manufacturing lifecycle, including:

  • Product assurance: printed boards, assemblies and wire harnesses.
  • Assembly and joining: solderability, solder alloys, bottom termination components and system-in-package technologies.
  • Base materials: laminates, metallic foils and metal-based substrates.
  • Rigid and flexible printed boards: design, fabrication and reliability.
  • Cleaning and coating: conformal coating, flux residues, CAF, potting and encapsulation.
  • Printed electronics: 3D plastronics and additively manufactured electronics.
  • Electronic data and traceability: design data transfer, Connected Factory Exchange, Hermes, materials and process traceability, supplier declaration data flows and CO₂e reporting.
  • High-speed/high-frequency electronics: RF/microwave performance and high-speed base materials.
  • Process control and reliability: automated inspection process control, SMT attachment reliability, inspection and microsection analysis.

The event also provides an entry point for companies that want to better understand how standards are developed and how participation can help them anticipate technical, customer and regulatory requirements.

IPC Builds will take place Sept. 19–24, 2026, in Paris, France. Registration is open at https://www.electronics.org/event/ipc-builds-standards-development-committee-meetings. There is no cost to attend.