IPC’s PCB Technology Trends Study Underway, PCB Fabricator Survey Open Until July 13
IPC launched a global survey of printed circuit board (PCB) manufacturers in the electronics industry this week. This confidential survey is part of a global data collection effort for the development of IPC’s 2018 PCB Technology Trends study. The deadline for PCB fabricator survey responses is July 13.
IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2019
IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. The technical conference will take place January 29–31, 2019. The extended deadline for technical conference abstracts is June 29, 2018.
IPC's PCB Technology Trends Study Underway, OEM Survey Open Until July 6
IPC launched a global survey of original equipment manufacturers (OEMs) in the electronics industry this week. This confidential survey is part of a global data collection effort for the development of IPC’s 2018 PCB Technology Trends study. The deadline for OEM survey responses is July 6.
IPC Hand Soldering Regional Qualification Competition Winner Crowned at SMT Hybrid Packaging 2018
The competition was fierce as 27 competitors went soldering iron to soldering iron in IPC’s Hand Soldering Regional Qualification Competition at SMT Hybrid Packaging 2018 in Nuremberg, Germany. Of the 27 boards submitted by the competitors only four of the electronic assemblies were functional. Taking first place and a cash prize of €300 was Catherine Cardinal-Simoan, Thales International, who earned 422 points out of a possible 445.
IPC Welcomes U.S. Senate Defense Bill; Provision on Military Electronics Reflects IPC’s Priorities
Reflecting input from IPC and its collaboration with Senator Joe Donnelly (D-IN), Section 862 of the bill calls on the Secretary of Defense, in consultation with the Executive Agent for Printed Circuit Board and Interconnect Technology (based at the Naval Surface Warfare Center in Crane, Indiana) and the Director of the Office of Management and Budget (OMB), to prepare a report to Congress by January 2019 on the health of the defense electronics industrial base.
Electronics and Textiles Come Together at IPC E-Textiles 2018
If your company has e-textiles and/or stretchable technologies on its roadmap and you find yourself asking the question, “How can I merge smart fabrics with smart engineering?” IPC has developed a technical and business education workshop to answer these questions and more. IPC E-Textiles 2018 will take place on September 13, 2018 in Des Plaines, Ill., and will bring together innovators, technologists and engineers to collaborate, and identify partners and solutions to propel growth for the e-textiles market.