IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”
Calling All California Employers: Harness State Funding for Workforce Training with IPC and ETP
IPC announces a pivotal opportunity for California employers under the Employment Training Panel (ETP) program. This initiative provides significant financial support for customized job skills training, reducing costs and enhancing the competencies of the workforce in today's challenging market.
WHMA/IPC Issues Call for Participation for Electrical Wire Processing Technology Expo 2025
WHMA/IPC invites engineers, researchers, academics, technical experts, and industry leaders to submit proposals for the Electrical Wire Processing Technology Expo (EWPTE), to be held May 6-8, 2025 at Baird Center in Milwaukee, Wis.
Registration Open for the 2025 WHMA Annual Global Leadership Summit
Registration is now open for the 2025 WHMA Annual Global Leadership Summit, the industry’s only annual executive networking event for the cable and wire harness manufacturing industry including manufacturers, their suppliers, and customers.
IPC’s Road to Reliability Webinar Series Covers New e-Mobility Technologies
Starting September 12, IPC’s Road to Reliability Webinar series will bring industry leaders together to discuss the hurdles in achieving reliability for new e-mobility technology. Speakers will examine reliability drivers, technology applications, and target lifecycles in each free webinar.
North American PCB Industry Sales Down 21.2 Percent in July
IPC announced today the July 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.99.