Advanced Packaging and Electronics Manufacturing from Silicon to Systems

Global Electronics Association works with the industry to develop a strong global and regional manufacturing ecosystem and resilient supply chains. Advanced semiconductor packaging requires IC substrate fabrication and directly impacts future PCB technology and assembly processes. 

To keep the supply chain from silicon to systems successful, Global Electronics Association advocates for the industry's bringing together of a wide variety of technologies to remain healthy and strong.

Papers and Articles

Advanced Packaging Board-Level Integration White Paper
Devan Iyer and Matt Kelly present the needs and challenges of Advanced Packaging to Board-Level Integration
AI-Based Data Centers - Technologies, Supply Chains, and Resiliency Gaps
This white paper explores the actions needed to improve the supply chain resiliency of U.S.-based artificial intelligence (AI) data centers and the electronics used in them.
iNEMI/Global Electronics Association White Paper
Complex Integrated Systems: The Future of Electronics Manufacturing
This white paper on complex integrated systems highlights future technology and manufacturing ecosystem needs.
North American Semiconductor and Advanced Packaging Ecosystem
An analysis of the Market and Rebuilding U.S. Capabilities for the 21st Century.
Global Electronics Association - Deep Dive on Advanced Packaging
Message to policymakers on building a more robust, domestic ecosystem for advanced electronics.
What's New in Advanced Packaging
Matt Kelly, Grace O'Malley, and Devan Iyer share their thoughts on Advanced Packaging, Silicon to Systems, and Complex Integrated Systems in Manufactruing

Building Advanced Packaging Capabilities for the 21st Century 

Advanced semiconductor packaging requires IC substrate fabrication and directly impacts future PCB technology and assembly processes.

Outsourced Semiconductor Assembly and Test (OSAT) requires expansion in capacity/capability to drive an end-to-end packaging ecosystem.

A healthy, capable assembly ecosystem is needed to combine various technologies to manufacture finished products. Any disruptions or bottlenecks within this end-to-end ecosystem can lead to delays in new products and innovations. Therefore, it takes all elements within the supply chain-from silicon to systems-to successfully produce electronic hardware products and meet customer and market demands. 

Towards a Robust Advanced Packaging Ecosystem
This report presents new research exploring what is needed to propel advanced packaging forward.

Featured News

Nuts and Bolts of Advanced Packaging
Interview with Matt Kelly, touching on board assembly and fabrication.
Chips Act Won't Work Without Every Part of the Chip
The Washington Post article on the Chips Act

Tools and Standards

Advanced Electronics Packaging Standards
Join our Advanced Electronics Packaging activities or suggest a new standard.

Leadership

Advanced Electronic Packaging Technology Council (ADEPT)
Connecting experts to shape the future of electronic packaging
Chief Technologist Council
Find out information on the council structure, the council mission and objectives, and council members