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New Concept Multi-Layer FPC “SBic” For High-Density Device Mounting

We have developed a thin,high-density device-mounting,multilayer flexible printed circuit (hereinafter flexible printed circuit is referred to as FPC) “SBic” (stands for Solder Bump Interconnec .. read more

New Concept Multi-Layer FPC “SBic” For High-Density Device Mounting

We have developed a thin,high-density device-mounting,multilayer flexible printed circuit (hereinafter flexible printed circuit is referred to as FPC) “SBic” (stands for Solder Bump Interconnec .. read more