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A Novel Epoxy Flux to Prevent Hot Tears at VIPPO Solder Joints
Via-in-Pad Plated Over (VIPPO) designs enable better signal quality and speed, but also cause unintended consequences. At VIPPO locations, with or without a solid copper-filled hole, the coe
.. read more
Characterization and Measurement of BGA Solder Joint Alloy Phase Solid State Thermal and Electromigration
A number of prior studies have established that solid state migration of solder alloy elemental phases will occur as a
function of temperature,time and voltage bias through the solder joint. Th
.. read more
A Novel Epoxy Flux to Prevent Hot Tears at VIPPO Solder Joints
Via-in-Pad Plated Over (VIPPO) designs enable better signal quality and speed, but also cause unintended consequences. At VIPPO locations, with or without a solid copper-filled hole, the coe
.. read more
Characterization and Measurement of BGA Solder Joint Alloy Phase Solid State Thermal and Electromigration
A number of prior studies have established that solid state migration of solder alloy elemental phases will occur as a
function of temperature,time and voltage bias through the solder joint. Th
.. read more