Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Reliability of Solder Alloys Depending on Different Substrate Characteristics (Type and Surface Finish)
Electrical components in a car are predicted to double within the next years. Increased functionality per PCB, miniaturization and higher power density are coming in parallel with this trend
.. read more
Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys
Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed
.. read more
Reliability of Solder Alloys Depending on Different Substrate Characteristics (Type and Surface Finish)
Electrical components in a car are predicted to double within the next years. Increased functionality per PCB, miniaturization and higher power density are coming in parallel with this trend
.. read more
Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys
Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed
.. read more