Knowledge Hub

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Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies

For mission critical electronics or Class III products,such as those used within the military,aerospace and medical industries,highest electronic reliability is a requirement as failure is not .. read more

Investigation of Process Feasibility / Compatibility and Solder Joint Reliability of Tin-Lead Dippable Solder Paste Ball Grid Array (BGA) Component...

This paper is an examination of the process feasibility,solder joint reliability,and materials/process compatibility of a dippable solder paste material for an area array component rework/repai .. read more

SELECTION OF WAVE SOLDERING FLUXES FOR LEAD-FREE ASSEMBLY

The process challenges of lead-free wave soldering often require the use of new flux chemistries when compared with the relatively tolerant tin-lead wave soldering process. In some cases,the fl .. read more

Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies

For mission critical electronics or Class III products,such as those used within the military,aerospace and medical industries,highest electronic reliability is a requirement as failure is not .. read more

Investigation of Process Feasibility / Compatibility and Solder Joint Reliability of Tin-Lead Dippable Solder Paste Ball Grid Array (BGA) Component...

This paper is an examination of the process feasibility,solder joint reliability,and materials/process compatibility of a dippable solder paste material for an area array component rework/repai .. read more

SELECTION OF WAVE SOLDERING FLUXES FOR LEAD-FREE ASSEMBLY

The process challenges of lead-free wave soldering often require the use of new flux chemistries when compared with the relatively tolerant tin-lead wave soldering process. In some cases,the fl .. read more