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Tin Corrosion under QFN Packages at Elevated Temperature and Humidity
Using X-ray imaging,solder corrosion,resembling metal migration,had been observed under QFN (Quad Flat No-Lead package) devices and chip resistors on circuit boards that were processed with two
.. read more
Tin Corrosion under QFN Packages at Elevated Temperature and Humidity
Using X-ray imaging,solder corrosion,resembling metal migration,had been observed under QFN (Quad Flat No-Lead package) devices and chip resistors on circuit boards that were processed with two
.. read more