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Improvement of Via Connection Reliability by Thinning Electroless Copper Plating
In the latest IC substrate PCBs, via holes have downsized and these diameters have minimized below 10μm, which have led to the issues of connection reliability. In a conventional process, ad
.. read more
Chemical “Kick Start” for the Autocatalytic Formaldehyde-Free Electroless Copper Plating Process
The present work describes the use of additives in formaldehyde-free copper solutions to improve the start reaction of
electroless copper deposition.
Conventional electroless copper plating sol
.. read more
A STUDY OF PLANAR MICROVOIDING IN Pb-FREE SOLDER JOINTS
Planar microvoids have been observed on second level interconnections between solder metallizations and copper lands on PCB boards with immersion silver surface finish. These planar microvoids
.. read more
Improvement of Via Connection Reliability by Thinning Electroless Copper Plating
In the latest IC substrate PCBs, via holes have downsized and these diameters have minimized below 10μm, which have led to the issues of connection reliability. In a conventional process, ad
.. read more
Chemical “Kick Start” for the Autocatalytic Formaldehyde-Free Electroless Copper Plating Process
The present work describes the use of additives in formaldehyde-free copper solutions to improve the start reaction of
electroless copper deposition.
Conventional electroless copper plating sol
.. read more
A STUDY OF PLANAR MICROVOIDING IN Pb-FREE SOLDER JOINTS
Planar microvoids have been observed on second level interconnections between solder metallizations and copper lands on PCB boards with immersion silver surface finish. These planar microvoids
.. read more