Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC
Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st
.. read more
The Enigmatic Breakout Angle
We describe a coupon design that makes available,in an elegant and efficient way,information unattainable even from multiple-coupon vertical cross-sections. The new design allows quantitative d
.. read more
Industrial PCB Development using Embedded Passive & Active Discrete Chips Focused on Process and DfR
For several years,3D-integration approaches have been explored to keep pace with the continuous trends towards electronics
miniaturization and densification. Numerous technologies issued from v
.. read more
Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes
The globalization of markets results in stronger competition with clearly noticeably cost pressure. For companies producing electronic equipment it is therefore of existential importance to red
.. read more
BGA Breakout Challenges
The routing of large pin-count and dense BGAs has a significant impact on the cost of the PCB,primarily in terms of layer count and via technology. This paper is the result of considerable rese
.. read more
Current Carrying Capacity in Printed Circuits,Past,Present and Future
In the present as in the past,printed circuit board conductors are sized using simple charts that are a function of
cross-sectional area,current level and conductor temperature rise. These char
.. read more
Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC
Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st
.. read more
The Enigmatic Breakout Angle
We describe a coupon design that makes available,in an elegant and efficient way,information unattainable even from multiple-coupon vertical cross-sections. The new design allows quantitative d
.. read more
Industrial PCB Development using Embedded Passive & Active Discrete Chips Focused on Process and DfR
For several years,3D-integration approaches have been explored to keep pace with the continuous trends towards electronics
miniaturization and densification. Numerous technologies issued from v
.. read more
Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes
The globalization of markets results in stronger competition with clearly noticeably cost pressure. For companies producing electronic equipment it is therefore of existential importance to red
.. read more
BGA Breakout Challenges
The routing of large pin-count and dense BGAs has a significant impact on the cost of the PCB,primarily in terms of layer count and via technology. This paper is the result of considerable rese
.. read more
Current Carrying Capacity in Printed Circuits,Past,Present and Future
In the present as in the past,printed circuit board conductors are sized using simple charts that are a function of
cross-sectional area,current level and conductor temperature rise. These char
.. read more