Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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AXI Applications with BTC and Connectors in Flextronics
Bottom Termination surface mount Components (BTC) are extremely popular because of their low cost,low stand-off height and excellent thermal and electrical properties. In this manufacturing are
.. read more
Pb-Free Selective Wave Solder Guidelines for Thermally Challenging PCBs
As the use of lead-free alloys has increased in electronic assemblies,much work has been done to develop Design for Manufacturability (DFM) guidelines for the new materials. However,there are s
.. read more
Reliability of Partially Filled SAC305 Through-Hole Joints
Consistently achieving acceptable wave solder through-hole fill on thick boards is a well-known process challenge,but the
introduction of lead free solders has created additional difficulties.
.. read more
AXI Applications with BTC and Connectors in Flextronics
Bottom Termination surface mount Components (BTC) are extremely popular because of their low cost,low stand-off height and excellent thermal and electrical properties. In this manufacturing are
.. read more
Pb-Free Selective Wave Solder Guidelines for Thermally Challenging PCBs
As the use of lead-free alloys has increased in electronic assemblies,much work has been done to develop Design for Manufacturability (DFM) guidelines for the new materials. However,there are s
.. read more
Reliability of Partially Filled SAC305 Through-Hole Joints
Consistently achieving acceptable wave solder through-hole fill on thick boards is a well-known process challenge,but the
introduction of lead free solders has created additional difficulties.
.. read more