Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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High Frequency Due to Copper Topology Phase 2 Project –Final Report High Density Packaging User Group (HDP)
The High Density Packaging (HDP) User Group has completed a project based upon an earlier project evaluating the different types of high frequency test methods used in the industry for measu
.. read more
New Technology to Improve Etching Performance using Shiny Side Surface Treatment for HDI
This paper discusses a new technology to improve etching performance using shiny side surface treatment on copper foil. Until now,a lot of electro-deposited copper foils (ED foil) with very low
.. read more
High Frequency Due to Copper Topology Phase 2 Project –Final Report High Density Packaging User Group (HDP)
The High Density Packaging (HDP) User Group has completed a project based upon an earlier project evaluating the different types of high frequency test methods used in the industry for measu
.. read more
New Technology to Improve Etching Performance using Shiny Side Surface Treatment for HDI
This paper discusses a new technology to improve etching performance using shiny side surface treatment on copper foil. Until now,a lot of electro-deposited copper foils (ED foil) with very low
.. read more