Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Method to Evaluate PCBA Suppliers’ Pb Free vs. Leaded Processes for Telecom
The purpose of this program was to evaluate the solder joint reliability,using the IPC-9701 standard as a guideline,of PCBAs that were assembled with conventional leaded and ROHS compliant lead
.. read more
Fluxless Sn-Ag Solder Joints between Silicon and Ag-Cladded Copper with Reliability Evaluations--MEJ
A fluxless bonding process between silicon and copper using Sn-rich Ag-Sn-Au multilayer composite has been developed.
The copper substrate is plated with a silver layer as stress buffer. We bon
.. read more
A Method to Evaluate PCBA Suppliers’ Pb Free vs. Leaded Processes for Telecom
The purpose of this program was to evaluate the solder joint reliability,using the IPC-9701 standard as a guideline,of PCBAs that were assembled with conventional leaded and ROHS compliant lead
.. read more
Fluxless Sn-Ag Solder Joints between Silicon and Ag-Cladded Copper with Reliability Evaluations--MEJ
A fluxless bonding process between silicon and copper using Sn-rich Ag-Sn-Au multilayer composite has been developed.
The copper substrate is plated with a silver layer as stress buffer. We bon
.. read more