Knowledge Hub

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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission

Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not d .. read more

A New Approach for Early Detection of PCB Pad Cratering Failures

Pad cratering refers to the initiation and propagation of fine cracks beneath BGA pads in organic substrates or printed circuit boards. These cracks,which usually initiate under the application .. read more

Drop Test Performance of A Medium Complexity Lead-Free Board After Assembly and Rework

The mechanical behavior of printed circuit assemblies (PCA) at high strain rates is very important for the reliability of products used in harsh environments. The transition to Pb-free material .. read more

Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission

Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not d .. read more

A New Approach for Early Detection of PCB Pad Cratering Failures

Pad cratering refers to the initiation and propagation of fine cracks beneath BGA pads in organic substrates or printed circuit boards. These cracks,which usually initiate under the application .. read more

Drop Test Performance of A Medium Complexity Lead-Free Board After Assembly and Rework

The mechanical behavior of printed circuit assemblies (PCA) at high strain rates is very important for the reliability of products used in harsh environments. The transition to Pb-free material .. read more