Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Thermal Improvement in 3D Embedded Modules Using Copper Bar Vias
The combination of increased I/O density, reduced footprint, and multi-die capability within a single platform makes embedded die an attractive solution. The benefits of embedding active die
.. read more
Electronic Packaging and Interconnect Tool Box for Secured Smart Systems Packaging
Security has become a vital part of electronic products as they handle sensitive data in uncontrolled environments and as they face more and more content protection issues. The paper will intro
.. read more
Thermal Improvement in 3D Embedded Modules Using Copper Bar Vias
The combination of increased I/O density, reduced footprint, and multi-die capability within a single platform makes embedded die an attractive solution. The benefits of embedding active die
.. read more
Electronic Packaging and Interconnect Tool Box for Secured Smart Systems Packaging
Security has become a vital part of electronic products as they handle sensitive data in uncontrolled environments and as they face more and more content protection issues. The paper will intro
.. read more