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Drill Hole Surface Roughness of a Toughened Epoxy-based Electrical Laminate
Phenolic cure of epoxy resins produces high glass transition temperature materials for electrical laminates fabrication. These resins are brittle due to the high crosslink densities. Consequent
.. read more
The Study of High Density PCB Reliability
The increase in board routing density,decrease the hole-to-hole spacing and lower to 0.30mm. High aspect ration PTH reliability is not the major issue since the plating copper has at least 20%
.. read more
Drill Hole Surface Roughness of a Toughened Epoxy-based Electrical Laminate
Phenolic cure of epoxy resins produces high glass transition temperature materials for electrical laminates fabrication. These resins are brittle due to the high crosslink densities. Consequent
.. read more
The Study of High Density PCB Reliability
The increase in board routing density,decrease the hole-to-hole spacing and lower to 0.30mm. High aspect ration PTH reliability is not the major issue since the plating copper has at least 20%
.. read more