Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Predicting the Lifetime of the PCB - From Experiment to Simulation
Two major drivers in electronic industry are electrical and mechanical miniaturization. Both induce major changes in the material selection as well as in the design. Nevertheless,the mechanical
.. read more
Warpage Issues and Assembly Challenges Using Coreless Package Substrate
Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a
.. read more
Flexural Fatigue Life Evaluation for Flexible Printed Circuit Boards
We report test results of bending characteristics of flexible printed circuit board,which contributes to the development of
higher density and more sophisticated function of mobile devices and
.. read more
Predicting the Lifetime of the PCB - From Experiment to Simulation
Two major drivers in electronic industry are electrical and mechanical miniaturization. Both induce major changes in the material selection as well as in the design. Nevertheless,the mechanical
.. read more
Warpage Issues and Assembly Challenges Using Coreless Package Substrate
Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a
.. read more
Flexural Fatigue Life Evaluation for Flexible Printed Circuit Boards
We report test results of bending characteristics of flexible printed circuit board,which contributes to the development of
higher density and more sophisticated function of mobile devices and
.. read more