Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Basic PCB Level Assembly Process Methodology for 3D Package-on-Package
The motivation for developing higher density IC packaging continues to be the market and the consumers’ expectation that
each new generation of products furnish greater functionality. The minia
.. read more
Large and Thick Board Lead-Free Wave Soldering Optimization
This paper presents the results of our study on the development and optimization of lead-free wave soldering process for large and thick printed circuit boards (PCB),through multiple designs of
.. read more
Basic PCB Level Assembly Process Methodology for 3D Package-on-Package
The motivation for developing higher density IC packaging continues to be the market and the consumers’ expectation that
each new generation of products furnish greater functionality. The minia
.. read more
Large and Thick Board Lead-Free Wave Soldering Optimization
This paper presents the results of our study on the development and optimization of lead-free wave soldering process for large and thick printed circuit boards (PCB),through multiple designs of
.. read more