Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd- Layers
As a surface finish,electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention
for both packaging/IC-substrate and PWB applications. With a lower gold
.. read more
Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards
Typical electrodeposition of conventional metals produces deposits that are polycrystalline in nature,comprised of many crystal grains separated by grain boundaries. Adding grain refiners to a
.. read more
Low Temperature Characteristics of Silicones
Silicones are often used to protect electronic applications designed for cold environments. The low temperature flexibility
of silicones is well recognized,but not as well understood. While the
.. read more
Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead
A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been
.. read more
Whisker Penetration into Conformal Coating
Tin whiskers are needle-like crystals of tin growing from pure tin or high-tin alloy surfaces,which may grow long enough to cause electrical shorts. Conformal coatings provide some protection a
.. read more
Lead Free Assembly Qualification of ALIVH Boards
The migration to lead free reflow is bringing many challenges for the PCB industry. High Tg laminates,stability of materials thru 2X reflows,rework,moisture sensitivity etc. This requires caref
.. read more
Characterization of Acid Copper Plating Solution for Via-Filling
The use of acid copper plating process for via-filling effectively forms interlayer connection in build-up PWBs with
high-density interconnections. However,in the case of copper film deposited
.. read more
Lead-Free Solder Bumping Technologies
Electroplated pure tin and tin alloys such as Sn99.3Cu0.7%,Sn98%Bi2% and Sn96.5%Ag3.5% have been identified as
viable drop-in replacements to tin-lead solder. High melting point tin alloys such
.. read more
Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd- Layers
As a surface finish,electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention
for both packaging/IC-substrate and PWB applications. With a lower gold
.. read more
Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards
Typical electrodeposition of conventional metals produces deposits that are polycrystalline in nature,comprised of many crystal grains separated by grain boundaries. Adding grain refiners to a
.. read more
Low Temperature Characteristics of Silicones
Silicones are often used to protect electronic applications designed for cold environments. The low temperature flexibility
of silicones is well recognized,but not as well understood. While the
.. read more
Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead
A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been
.. read more
Whisker Penetration into Conformal Coating
Tin whiskers are needle-like crystals of tin growing from pure tin or high-tin alloy surfaces,which may grow long enough to cause electrical shorts. Conformal coatings provide some protection a
.. read more
Lead Free Assembly Qualification of ALIVH Boards
The migration to lead free reflow is bringing many challenges for the PCB industry. High Tg laminates,stability of materials thru 2X reflows,rework,moisture sensitivity etc. This requires caref
.. read more
Characterization of Acid Copper Plating Solution for Via-Filling
The use of acid copper plating process for via-filling effectively forms interlayer connection in build-up PWBs with
high-density interconnections. However,in the case of copper film deposited
.. read more
Lead-Free Solder Bumping Technologies
Electroplated pure tin and tin alloys such as Sn99.3Cu0.7%,Sn98%Bi2% and Sn96.5%Ag3.5% have been identified as
viable drop-in replacements to tin-lead solder. High melting point tin alloys such
.. read more