Knowledge Hub

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Reliability Impact of Frequent Power Cycles on Base Printed Wiring Boards High Density Packaging User Group (HDP)

The High Density Packaging (HDP) user group has completed a project to evaluate the impact on field reliability of more frequent thermal cycling over more narrow operating temperature ranges .. read more

Moisture Effects on the High Frequency Testing of Laminates

Earlier HDP User Group project work that has been completed and published compared the different types of high frequency test methods used in the industry for measuring Dk and Df at high fre .. read more

High Frequency Dk and Df Test Methods Comparison,High Density Packaging User Group (HDP) Project

The High Density Packaging (HDP) user group working on high frequency test methods,used for speeds above 2.0 GHz,is developing a way of comparing how sensitive each of the various high frequenc .. read more

Market Forecast and Applications for 3D Packaging using Package-on-Package (PoP)

- 3D Manufacturing solutions: Flexible integration - 3D/SiP Cost of Ownership - Die vs. Package Stack Analysis - Smartphone - Package evolution - Handheld Processor Roadmap - PoP - TMV - Future .. read more

Advanced Packaging Using Liquid Crystalline Polymer (LCP) Substrates

Liquid crystalline polymer (LCP) substrates offer a number of advantages for high-density packaging. These properties include high temperature capability (>250oC),low coefficient of thermal exp .. read more

Reliability Impact of Frequent Power Cycles on Base Printed Wiring Boards High Density Packaging User Group (HDP)

The High Density Packaging (HDP) user group has completed a project to evaluate the impact on field reliability of more frequent thermal cycling over more narrow operating temperature ranges .. read more

Moisture Effects on the High Frequency Testing of Laminates

Earlier HDP User Group project work that has been completed and published compared the different types of high frequency test methods used in the industry for measuring Dk and Df at high fre .. read more

High Frequency Dk and Df Test Methods Comparison,High Density Packaging User Group (HDP) Project

The High Density Packaging (HDP) user group working on high frequency test methods,used for speeds above 2.0 GHz,is developing a way of comparing how sensitive each of the various high frequenc .. read more

Market Forecast and Applications for 3D Packaging using Package-on-Package (PoP)

- 3D Manufacturing solutions: Flexible integration - 3D/SiP Cost of Ownership - Die vs. Package Stack Analysis - Smartphone - Package evolution - Handheld Processor Roadmap - PoP - TMV - Future .. read more

Advanced Packaging Using Liquid Crystalline Polymer (LCP) Substrates

Liquid crystalline polymer (LCP) substrates offer a number of advantages for high-density packaging. These properties include high temperature capability (>250oC),low coefficient of thermal exp .. read more