Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Newest ED-Copper Foils for Low Loss / High Speed PCBs and for IC-Packaging
The latest status of new ED copper foil developments is presented: ultra-flat profile for high speed digital boards and ultra-thin foil for finest pitch applications.
Copper surface roughness h
.. read more
PCB Board Design Considerations for Impedance Control and Optimal Signal Integrity in High Speed Digital and RF Systems
For the electronics on PCB’s,dielectric materials provide not only material and media support for the high-speed digital and RF systems,but also electrical performance. Impedance control and si
.. read more
Using Embedded Capacitance to Improve Electrical Performance,Eliminate Capacitors and Reduce Board Size In High Speed Digital and RF Applications
The global electronics industry is exhibiting a widespread and growing interest in the technology of embedded passives. This interest can be attributed to three primary benefits. First,embedded
.. read more
Next Generation High Density Build-Up PKG Substrate
In recent years,along with the further progress of network systems,mobile communication systems and high performance
servers printed wiring boards (PWBs),which are key components in these produ
.. read more
Insertion Loss,Eye Pattern and Crosstalk Analysis of Mixed Dielectric Striplines (Simulation and Measurement)
As digital data rates reach 5Gb/s,10Gb/s and beyond,digital designers are finding it increasingly difficult to meet their
design constraints using FR4. While there are a host of alternative mat
.. read more
The Impact of “High Speed Systems” on Electrical and Optical Interconnect
High speed systems operating at speeds of 2GHz and above are placing increasing demands on the
specifications of substrates and packaging of
components used within these systems. BPA has
review
.. read more
Newest ED-Copper Foils for Low Loss / High Speed PCBs and for IC-Packaging
The latest status of new ED copper foil developments is presented: ultra-flat profile for high speed digital boards and ultra-thin foil for finest pitch applications.
Copper surface roughness h
.. read more
PCB Board Design Considerations for Impedance Control and Optimal Signal Integrity in High Speed Digital and RF Systems
For the electronics on PCB’s,dielectric materials provide not only material and media support for the high-speed digital and RF systems,but also electrical performance. Impedance control and si
.. read more
Using Embedded Capacitance to Improve Electrical Performance,Eliminate Capacitors and Reduce Board Size In High Speed Digital and RF Applications
The global electronics industry is exhibiting a widespread and growing interest in the technology of embedded passives. This interest can be attributed to three primary benefits. First,embedded
.. read more
Next Generation High Density Build-Up PKG Substrate
In recent years,along with the further progress of network systems,mobile communication systems and high performance
servers printed wiring boards (PWBs),which are key components in these produ
.. read more
Insertion Loss,Eye Pattern and Crosstalk Analysis of Mixed Dielectric Striplines (Simulation and Measurement)
As digital data rates reach 5Gb/s,10Gb/s and beyond,digital designers are finding it increasingly difficult to meet their
design constraints using FR4. While there are a host of alternative mat
.. read more
The Impact of “High Speed Systems” on Electrical and Optical Interconnect
High speed systems operating at speeds of 2GHz and above are placing increasing demands on the
specifications of substrates and packaging of
components used within these systems. BPA has
review
.. read more