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The Effects of Lead-Free Reflow on Conductive Anodic Filament (CAF) Performance of Materials

This paper details the results achieved by the High Density Packaging Users Group (HDPUG) Consortium investigating the hole-wall to hole-wall CAF performance of 20 different Pb-free printed wir .. read more

Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor

Values for printed circuit board (PCB) laminate dielectric constant (Dk) and dissipation factor (Df) used in circuit design and signal integrity (SI) modeling are typically those presented on l .. read more

Base Material Consideration for High Speed Printed Circuit Boards

Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon .. read more

Bifunctional Low Molecular Weight Polyphenylene Ether Resins for PWB Base Materials

A new bifunctional low molecular weight polyphenylene ether (OPE oligophenylene ether) was obtained by the oxidative coupling of 2,2’,3,3’,5,5’-hexamethyl-[1,1’-biphenyl]-4,4’-diol (HMBP hexame .. read more

Via Hole Filling Technology for High Density,High Aspect Ratio Printed Wiring Boards Using a High Tg,low CTE Plugging Paste

The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and .. read more

The Effects of Lead-Free Reflow on Conductive Anodic Filament (CAF) Performance of Materials

This paper details the results achieved by the High Density Packaging Users Group (HDPUG) Consortium investigating the hole-wall to hole-wall CAF performance of 20 different Pb-free printed wir .. read more

Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor

Values for printed circuit board (PCB) laminate dielectric constant (Dk) and dissipation factor (Df) used in circuit design and signal integrity (SI) modeling are typically those presented on l .. read more

Base Material Consideration for High Speed Printed Circuit Boards

Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon .. read more

Bifunctional Low Molecular Weight Polyphenylene Ether Resins for PWB Base Materials

A new bifunctional low molecular weight polyphenylene ether (OPE oligophenylene ether) was obtained by the oxidative coupling of 2,2’,3,3’,5,5’-hexamethyl-[1,1’-biphenyl]-4,4’-diol (HMBP hexame .. read more

Via Hole Filling Technology for High Density,High Aspect Ratio Printed Wiring Boards Using a High Tg,low CTE Plugging Paste

The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and .. read more