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Optimizing Thermo-Mechanical Reliability of Components with Flat Gull Wing Leads

IPC J-STD-001Fand IPC-A-610F require a minimum Heel Fillet Height (F) for Flat Gull Wing Leads of solder thickness (G) plus lead thickness (T) for Class 3 products.[1]It is shown in this work t .. read more

Design Improvements for Selective Soldering Assemblies

Selective soldering,along with pin-in-paste reflow and press fit,is the primary assembly method for through-hole components. The reflow process is limited by component dimensions and heat resis .. read more

PCB Cleanliness Assessment Methodologies - A Comparative Study

PCB manufacturers use a wide variety of solder pastes and fluxes including No-Clean,RMA and OA,both leaded and lead-free within their processes. As part of the manufacturing process,components .. read more

Optimizing Thermo-Mechanical Reliability of Components with Flat Gull Wing Leads

IPC J-STD-001Fand IPC-A-610F require a minimum Heel Fillet Height (F) for Flat Gull Wing Leads of solder thickness (G) plus lead thickness (T) for Class 3 products.[1]It is shown in this work t .. read more

Design Improvements for Selective Soldering Assemblies

Selective soldering,along with pin-in-paste reflow and press fit,is the primary assembly method for through-hole components. The reflow process is limited by component dimensions and heat resis .. read more

PCB Cleanliness Assessment Methodologies - A Comparative Study

PCB manufacturers use a wide variety of solder pastes and fluxes including No-Clean,RMA and OA,both leaded and lead-free within their processes. As part of the manufacturing process,components .. read more